Semiconductor batch production equipment and semiconductor batch system
A technology of production equipment and batch processing, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as wafer breakage, wafer boat imbalance, wafer contamination, etc., to avoid production accidents, low cost, disassembly, etc. and ease of use
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Embodiment 1
[0064] see Figure 1 to Figure 6 . Such as figure 1 As shown, the present invention provides a semiconductor batch production equipment 6, and the semiconductor batch production equipment 6 includes:
[0065] reaction chamber 1;
[0066] a wafer loading area 2, having a load-lock vacuum device 3, and connected to the reaction chamber 1;
[0067] The wafer boat carrier 5 is used to carry the wafer boat 4 and drive the wafer boat 4 to move between the reaction chamber 1 and the wafer loading area 2; and,
[0068] An inductive detection device 53 , the inductive detection device 53 is located on the wafer carrier 5 .
[0069] Such as figure 2 As shown, as an example, the wafer boat carrier 5 includes a horizontal loading platform 51 for placing the wafer boat 4 and a rotating shaft 521 for driving the wafer boat 4 to rotate, and the induction detection device 53 can be located on the horizontal loading platform 51 of the lower surface.
[0070] Such as image 3 As shown,...
Embodiment 2
[0077] Such as Figure 7 shown. The induction detection device 53 of the present invention includes:
[0078] The level sensor 531 is located on the wafer carrier 5 and is used to sense and detect the horizontal state of the wafer carrier 5; and,
[0079] The vibration sensor 532 is located on the wafer boat carrier 5 and is used for inductively detecting the vibration state of the wafer boat carrier 5 .
[0080] Such as Figure 7 As shown, in an example, the induction detection device 53 also includes a storage comparator 533, the storage comparator 533 is connected to the level sensor 531 and the vibration sensor 532 for storing the reference level value and Reference vibration value, and compare the level value of the wafer carrier 5 detected by the level sensor 531 with the reference level value, and compare the wafer carrier 5 detected by the vibration sensor 532 The vibration value of the device 5 is compared with the reference vibration value.
[0081] As an exampl...
Embodiment 3
[0085] Such as Figure 8 As shown, in another example, in addition to the level sensor 531 and the vibration sensor 532 as described in the second embodiment, the induction detection device 53 also includes:
[0086] The pressure sensor 539 is located on the wafer carrier 5 and is used to sense and detect the pressure state of the wafer carrier 5; and,
[0087] Storage comparator 533, described storage comparator 533 is connected with described level sensor 531, described vibration sensor 532 and described pressure sensor 539, is used for storing reference level value, reference vibration value and reference pressure value, and all The horizontal value of the wafer carrier 5 detected by the level sensor 531 is compared with the reference horizontal value, and the vibration value of the wafer carrier 5 detected by the vibration sensor 532 is compared with the reference level value. The reference vibration value is compared with the reference vibration value, and the pressure v...
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