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Semiconductor batch production equipment and semiconductor batch system

A technology of production equipment and batch processing, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as wafer breakage, wafer boat imbalance, wafer contamination, etc., to avoid production accidents, low cost, disassembly, etc. and ease of use

Active Publication Date: 2020-09-08
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor batch processing production equipment and a semiconductor batch processing system, which are used to solve the problems in the prior art that cannot be detected in time due to the imbalance of the wafer carrier. Issues where the boat becomes out of balance and eventually leads to major production incidents such as wafer contamination and / or wafer breakage

Method used

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  • Semiconductor batch production equipment and semiconductor batch system
  • Semiconductor batch production equipment and semiconductor batch system
  • Semiconductor batch production equipment and semiconductor batch system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] see Figure 1 to Figure 6 . Such as figure 1 As shown, the present invention provides a semiconductor batch production equipment 6, and the semiconductor batch production equipment 6 includes:

[0065] reaction chamber 1;

[0066] a wafer loading area 2, having a load-lock vacuum device 3, and connected to the reaction chamber 1;

[0067] The wafer boat carrier 5 is used to carry the wafer boat 4 and drive the wafer boat 4 to move between the reaction chamber 1 and the wafer loading area 2; and,

[0068] An inductive detection device 53 , the inductive detection device 53 is located on the wafer carrier 5 .

[0069] Such as figure 2 As shown, as an example, the wafer boat carrier 5 includes a horizontal loading platform 51 for placing the wafer boat 4 and a rotating shaft 521 for driving the wafer boat 4 to rotate, and the induction detection device 53 can be located on the horizontal loading platform 51 of the lower surface.

[0070] Such as image 3 As shown,...

Embodiment 2

[0077] Such as Figure 7 shown. The induction detection device 53 of the present invention includes:

[0078] The level sensor 531 is located on the wafer carrier 5 and is used to sense and detect the horizontal state of the wafer carrier 5; and,

[0079] The vibration sensor 532 is located on the wafer boat carrier 5 and is used for inductively detecting the vibration state of the wafer boat carrier 5 .

[0080] Such as Figure 7 As shown, in an example, the induction detection device 53 also includes a storage comparator 533, the storage comparator 533 is connected to the level sensor 531 and the vibration sensor 532 for storing the reference level value and Reference vibration value, and compare the level value of the wafer carrier 5 detected by the level sensor 531 with the reference level value, and compare the wafer carrier 5 detected by the vibration sensor 532 The vibration value of the device 5 is compared with the reference vibration value.

[0081] As an exampl...

Embodiment 3

[0085] Such as Figure 8 As shown, in another example, in addition to the level sensor 531 and the vibration sensor 532 as described in the second embodiment, the induction detection device 53 also includes:

[0086] The pressure sensor 539 is located on the wafer carrier 5 and is used to sense and detect the pressure state of the wafer carrier 5; and,

[0087] Storage comparator 533, described storage comparator 533 is connected with described level sensor 531, described vibration sensor 532 and described pressure sensor 539, is used for storing reference level value, reference vibration value and reference pressure value, and all The horizontal value of the wafer carrier 5 detected by the level sensor 531 is compared with the reference horizontal value, and the vibration value of the wafer carrier 5 detected by the vibration sensor 532 is compared with the reference level value. The reference vibration value is compared with the reference vibration value, and the pressure v...

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PUM

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Abstract

The invention provides semiconductor batch processing production equipment and a semiconductor batch processing system. A sensing detection device is arranged on a boat loader of the semiconductor batch processing production equipment; the sensing detection device comprises a horizon sensor for sensing and detecting a horizontal state of the boat loader and a vibration sensor for sensing and detecting a vibration state of the boat loader; and the semiconductor batch processing production equipment has the advantages of convenience for installation, disassembling and use, low cost, sensitivityfor sensing and detection and the like. The semiconductor batch processing production equipment provided by the invention senses the horizontal state and the vibration state of the boat loader in realtime by the sensing detection device, can avoid placement of a boat on the boat loader in a case that the boat loader is out of balance in horizon or / and abnormal in vibration, and in a case that theboat is placed on the boat loader, can monitor a state of the boat in real time by monitoring the boat loader so as to avoid a production accident; and the batch processing system sufficiently utilizes existing facilities in a semiconductor manufacturer to implement effective monitoring on the production process.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor batch processing production equipment and a semiconductor batch processing system. Background technique [0002] In the semiconductor manufacturing process, most of the process production is monolithic, that is, a single reaction chamber can only process a single wafer at a time, while the furnace tube batch processing equipment can process dozens or even wafers at a time. The process of hundreds of wafers has greatly improved the production efficiency of semiconductor manufacturing. However, while this batch processing equipment has high production efficiency, it also hides great risks. For example, if the equipment fails or the process fails, hundreds of wafers in the entire batch may have to be scrapped, and the loss is very high. Therefore, it is particularly important to monitor and control batch processing equipment in advance to eliminate hidden ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67253H01L21/67276
Inventor 不公告发明人
Owner CHANGXIN MEMORY TECH INC