Adhesive and insulating reinforcing tape containing adhesive

Abstract

The invention provides an adhesive and an insulating reinforcing tape including the adhesive. The adhesive includes the following components (by weight): 100 parts of epoxy resin, 5-20 parts of thermoplastic resin, 20-100 parts of rubber, and 5-30 parts of a curing agent. The insulating reinforcing tape includes an insulating substrate and an adhesive layer disposed on the insulating substrate, wherein the adhesive layer is formed of the above adhesive. The adhesive provided by the invention has high adhesive force, heat resistance and good fluidity, and the insulating reinforcing tape prepared by the invention has small amount of glue overflow during hot-pressing, good adhesive property, strong deformation plasticity and good pressure fillibility, is easy for hot-press forming, low-cost,can be used for reinforcement and insulation coating of flexible circuit boards.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive and an insulating and reinforcing adhesive tape containing the adhesive. Background technique [0002] In recent years, new energy vehicles have developed rapidly, among which the development of pure electric vehicles has attracted the most attention, and has also received strong support from governments of various countries. Pure electric vehicles (Electric Vehicles) are vehicles that use a single battery as the energy storage power source. It uses the battery as the energy storage power source, and supplies electric energy to the motor through the battery to drive the motor to run, thereby driving the car. [0003] The battery management system of the power battery of an electric vehicle is the nerve center of the battery pack. The short circuit or overload protection and temperature collection of the battery pack were originally completed using wiring...

AI Technical Summary

Problems solved by technology

However, the heat distortion temperature of the epoxy resin composition is below 140°C, and the heat resistance is still low

CN 108485566A discloses a method for preparing an adhesive for electronic components, using heat dissipation media such as carboxyl-terminated nitrile rubber and boron nitride to modify epoxy resin, but only improves the heat dissipation performance of the adhesive, and does not pay attention heat resistance

In addition, the existing insulation reinforcing tape still has the problems of high cost, easy overflow of glue by hot pressing, high modulus, and small deformation capacity, which is not conducive to the coating and filling of FPC connecting pieces, and may easily cause local gaps. The insulation of the product Creepage and reliability are at risk

Images