High-speed thermal expansion driver

Abstract

The invention relates to a high-speed thermal expansion driver. The high-speed thermal expansion driver comprises a first sheet and a second sheet, and is characterized by further comprising refrigerating sheets, wherein the first sheet and the second sheet are made of high thermal expansion coefficient materials; each refrigerating sheet is a semiconductor refrigerator composed of a P type semiconductor element and a N type semiconductor element, and the upper surface and the lower surface of each refrigerating sheet are a refrigerating pole and a heating pole; and the refrigerating sheets are installed between the first sheet and the second sheet, the refrigerating poles and the heating poles are attached to the first sheet and the second sheet respectively, and every two adjacent refrigerating sheets have opposite polarity. Because the temperature formed by the refrigerating sheets can reach below 30 DEG C, the cooling speed of the refrigerating sheets is much higher than the traditional air cooling or natural cooling method, fast response of the driver can be realized, and the problem of slow response speed of a traditional bimetallic strip driver is solved. The invention relates to a high-speed thermal expansion driver. The high-speed thermal expansion driver comprises a first sheet and a second sheet, and is characterized by further comprising refrigerating sheets, wherein the first sheet and the second sheet are made of high thermal expansion coefficient materials; each refrigerating sheet is a semiconductor refrigerator composed of a P type semiconductor element and a N type semiconductor element, and the upper surface and the lower surface of each refrigerating sheet are a refrigerating pole and a heating pole; and the refrigerating sheets are installed between the first sheet and the second sheet, the refrigerating poles and the heating poles are attached to the first sheet and the second sheet respectively, and every two adjacent refrigerating sheets have opposite polarity. Because the temperature formed by the refrigerating sheets can reach below 30 DEG C, the cooling speed of the refrigerating sheets is much higher than the traditional air coolingor natural cooling method, fast response of the driver can be realized, and the problem of slow response speed of a traditional bimetallic strip driver is solved.

Description

Technical field [0001] The invention belongs to the field of novel drives, and specifically relates to a high-speed thermal expansion drive. Background technique [0002] With the development of functional materials, new actuators based on functional materials have been widely used in recent years, solving a large number of practical problems in the fields of electromechanics, medical treatment, communication, security, robotics, etc., providing new vitality for the development of the above fields . The bimetallic driver made of metal thermal expansion characteristics is a typical driver for industrial use. In recent years, it has been used in electrical engineering, household appliances and other fields. It has a good source of materials and industrial foundation, and its structure is simple and cost-effective. The advantages of low output force and large displacement make it a new type of driver with broad application prospects. However, as a reciprocating deformation drive, ...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of slow response in the temperature control process of the current bimetal actuator, a high-speed thermal expansion actuator is proposed. The high-speed thermal expansion actuator is composed of the first sheet, the second sheet and the cooling sheet. To obtain the high temperature and low temperature on the two poles, by controlling two adjacent refrigeration sheets with different polarities to work alternately, the two materials with high thermal expansion coefficients are elongated and shortened respectively, forming the bending motion of the driver. Since the refrigeration sheet has semiconductor refrigeration The structure of the drive is easy to control and the cooling speed is fast, which can effectively solve the problem of insufficient drive response speed caused by the slow cooling speed of the current drive.

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