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A multi-core chip thermal management method based on a recurrent neural network

A cyclic neural network and thermal management technology, applied in biological neural network models, physical implementation, information technology support systems, etc., can solve problems such as model errors, achieve temperature management, avoid long-term dependency problems, and efficient temperature management. Effect

Inactive Publication Date: 2019-04-26
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first is a simple linearization of the static power consumption, which will lead to a large model error; the second is to use a polynomial approximation model, but because it is still a nonlinear model, it can only be used for a single Core Chip System

Method used

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  • A multi-core chip thermal management method based on a recurrent neural network
  • A multi-core chip thermal management method based on a recurrent neural network
  • A multi-core chip thermal management method based on a recurrent neural network

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Embodiment Construction

[0019] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the examples of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the examples of the present invention. Obviously, the described examples are a part of the present invention instance, but not all instances. Based on the examples in the present invention, all other examples obtained by persons of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

[0020] figure 1 A comparison graph of static power consumption versus temperature for the PTM-MG 7nm FinFET using HSPICE simulation and curve fitting methods.

[0021] In the example of this invention, we use the PTM-MG 7nm FinFET process. For a multi-core chip system, chip power consumption is composed of dynamic power consumption and static power consumption. The dynamic powe...

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Abstract

The invention relates to the technical field of information control, and discloses a multi-core chip thermal management method based on a recurrent neural network. According to the invention, a multi-core chip thermal model is established by using a recurrent neural network method, and a long-term dependency problem exists when a traditional recurrent neural network establishes a thermal model fora multi-core chip considering static power consumption; The problem is avoided by adopting an echo state network method, and an accurate thermal model is established for the multi-core chip. And thethermal model is combined with an improved model predictive control method to carry out effective thermal management on the multi-core chip. According to the method, a chip temperature is read from amulti-core chip system, a state variable is calculated by using a Kalman filter, the variable is substituted into a model prediction control method based on an echo state network, and corresponding required dynamic power input distribution is calculated according to a target temperature. According to the invention, the accurate echo state network model and the advanced model prediction control method are combined, so that the optimal effect of thermal management can be achieved.

Description

technical field [0001] The invention belongs to the field of electronic design automation, relates to the technical field of information control, and particularly relates to a multi-core chip thermal management method based on a cyclic neural network. Background technique [0002] Now, with the continuous improvement of the technology level, the power density of the device continues to increase, resulting in many heat-related problems in high-performance multi-core processors, such as system reliability problems and performance degradation. In order to find a cost-effective way to solve this problem, the researchers proposed to use dynamic thermal management to manage the thermal performance of multi-core chips through task migration and dynamic voltage frequency adjustment. In order to better guide these thermal management behaviors, dynamic thermal management methods are combined with other advanced control methods, such as traditional model predictive control methods base...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06N3/063
CPCG06N3/065Y04S10/50Y02E40/70
Inventor 王海郭星星李伟
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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