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Systems with multiple layers of semiconductor x-ray detectors

An X-ray and detector technology, applied in the field of packaged semiconductor X-ray detectors, can solve the problems of difficult and impossible production of detectors with large areas and a large number of pixels

Active Publication Date: 2019-04-26
SHENZHEN XPECTVISION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cumbersome thermal management required in existing semiconductor X-ray detectors (e.g., Medipix) can make detectors with large areas and large numbers of pixels difficult or impossible to produce

Method used

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  • Systems with multiple layers of semiconductor x-ray detectors
  • Systems with multiple layers of semiconductor x-ray detectors
  • Systems with multiple layers of semiconductor x-ray detectors

Examples

Experimental program
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Effect test

Embodiment Construction

[0069] Figure 1A A cross-sectional view of a detector 100 according to an embodiment is schematically shown. The detector 100 may include an X-ray absorbing layer 110 and an electronic layer 120 (for example, an ASIC) for processing or analyzing electrical signals generated in the X-ray absorbing layer 110 by incident X-rays. In an embodiment, detector 100 does not include a scintillator. The X-ray absorbing layer 110 may include semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe or combinations thereof. Semiconductors can have high mass attenuation coefficients for x-ray energies of interest.

[0070] as in Figure 1B As shown in the detailed cross-sectional view of the detector 100, according to an embodiment, the X-ray absorbing layer 110 may include one or more discrete regions 114 formed by the first doped region 111, the second doped region 113 One or more diodes (eg, p-i-n or p-n). The second doped region 113 may be separated from the first dope...

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Abstract

A system comprising multiple layers of X-ray detectors. The top layer may have through-wafer vias (126). The other layers may have bonding wires (701). The bonding wires (701) are shadowed by the X-ray absorption layers in the layers above.

Description

【Technical field】 [0001] The present disclosure relates to X-ray detectors, and more particularly to methods of packaging semiconductor X-ray detectors. 【Background technique】 [0002] An X-ray detector may be a device for measuring the flux, spatial distribution, spectral or other properties of X-rays. [0003] X-ray detectors are used in many applications. An important application is imaging. X-ray imaging is a radiographic technique and can be used to reveal the internal structure of inhomogeneously composed and opaque objects such as the human body. [0004] Early X-ray detectors used for imaging included photographic negatives and photographic film. The photographic negative can be a glass negative with an emulsion coating. Although photographic negatives have been replaced by photographic films, they are still used in special cases due to the superior qualities they offer and their extreme stability. A photographic film can be a plastic film (eg, a tape or sheet) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01T1/24
CPCG01T1/242H01L27/14634H01L25/167H01L27/14676G01T1/241G01T1/243
Inventor 曹培炎刘雨润
Owner SHENZHEN XPECTVISION TECH CO LTD
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