Circuit board processing method and device
A processing method and circuit board technology, applied in the direction of electrical digital data processing, special data processing applications, instruments, etc., can solve the problems of inability to dissipate heat from the circuit board, unable to obtain the actual temperature of the circuit board, etc., and achieve a good heat dissipation effect.
Active Publication Date: 2019-05-03
BEIJING BITMAIN TECH LTD
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Problems solved by technology
[0005] The present application provides a circuit board processing method and device to solve the problem that the actual temperature of each area on the circuit board cannot be obtained, and thus the heat dissipation of each area of the circuit board cannot be well processed
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[0047] In order to understand the features and technical content of the embodiments of the present application in more detail, the implementation of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present application. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.
[0048] In the prior art, after setting each component on the circuit board, the temperature measuring unit is set on the vacant position on the circuit board; or, the temperature measuring unit is arranged on the circui...
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The invention relates to a circuit board processing method and device, and the method comprises the steps: determining the predicted temperature information of a circuit board, and enabling the predicted temperature information to be the temperature information obtained through the analog simulation of the circuit board; and determining a heat dissipation strategy of the circuit board according tothe predicted temperature information. Therefore, simulation calculation can be carried out on the circuit board through the thermal simulation technology, and the predicted heating condition of eacharea on the circuit board is obtained; A heat dissipation strategy can be configured for the circuit board according to the predicted heating condition of each region; Compared with the prior art, the scheme provided by the invention can scientifically and accurately determine the heating condition of the circuit board, thereby facilitating good heat dissipation of each area of the circuit board.
Description
technical field [0001] The present application relates to the field of supercomputing equipment, for example, to a circuit board processing method and device. Background technique [0002] Usually, at least one circuit board will be set in the supercomputing device, and multiple components, such as chips and sensors, will be set on the circuit board. [0003] In the prior art, in order to know the temperature of each position of the circuit board during the working process, a corresponding temperature measuring unit can usually be arranged on the circuit board. In practice, the main components are often installed on the circuit board first, and then the temperature measurement unit is installed on the vacant position on the circuit board; or, the temperature measurement unit is directly installed on the circuit board according to experience or at will. [0004] However, in the above methods, the temperature measurement unit cannot accurately measure the actual temperature o...
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Login to View More IPC IPC(8): G06F17/50
CPCY02D10/00
Inventor 赵宇淳
Owner BEIJING BITMAIN TECH LTD