Display backplane, manufacturing method thereof, and display device
A technology for displaying backplanes and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as identifying the impact of alignment marks, and achieve simple and easy processes, avoiding poor alignment, and mass production Feasible effect
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[0037] In order to further illustrate the display backplane, its manufacturing method, and display device provided by the embodiments of the present invention, a detailed description will be given below in conjunction with the accompanying drawings.
[0038] Such as Figure 4-Figure 6 As shown, the embodiment of the present invention provides a display backplane, including a substrate 1, electronic devices and alignment marks 3 disposed on the substrate 1, the display backplane also includes a filling layer 2, and the filling layer 2 fills The minimum distance between the orthographic projection of at least part of the recessed area 4 on the substrate 1 and the orthographic projection of the alignment mark 3 on the substrate 1 is less than 200 μm.
[0039] Specifically, the electronic device and the alignment mark 3 can be formed on the same side of the substrate 1 first, and then the filling layer 2 is formed on the surface of the substrate 1 facing away from the electronic d...
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