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Display backplane, manufacturing method thereof, and display device

A technology for displaying backplanes and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as identifying the impact of alignment marks, and achieve simple and easy processes, avoiding poor alignment, and mass production Feasible effect

Active Publication Date: 2021-09-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a display backplane, its manufacturing method, and a display device, which are used to solve the problem in the prior art that the recessed area on the substrate in the display backplane easily affects the identification of the alignment mark

Method used

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  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device
  • Display backplane, manufacturing method thereof, and display device

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Embodiment Construction

[0037] In order to further illustrate the display backplane, its manufacturing method, and display device provided by the embodiments of the present invention, a detailed description will be given below in conjunction with the accompanying drawings.

[0038] Such as Figure 4-Figure 6 As shown, the embodiment of the present invention provides a display backplane, including a substrate 1, electronic devices and alignment marks 3 disposed on the substrate 1, the display backplane also includes a filling layer 2, and the filling layer 2 fills The minimum distance between the orthographic projection of at least part of the recessed area 4 on the substrate 1 and the orthographic projection of the alignment mark 3 on the substrate 1 is less than 200 μm.

[0039] Specifically, the electronic device and the alignment mark 3 can be formed on the same side of the substrate 1 first, and then the filling layer 2 is formed on the surface of the substrate 1 facing away from the electronic d...

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PUM

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Abstract

The invention discloses a display backplane, a manufacturing method thereof, and a display device, and relates to the field of display technology, in order to solve the problem in the prior art that the recessed area on the base of the display backplane easily affects the identification of alignment marks. The display backplane includes a substrate, electronic devices and alignment marks disposed on the substrate, and the display backplane also includes: a filling layer, the filling layer filling the surface of the substrate facing away from the electronic devices The minimum distance between the orthographic projection of the at least part of the recessed area on the substrate and the orthographic projection of the alignment mark on the substrate is less than 200 μm. The display backplane provided by the invention is used for making a display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display backplane, a manufacturing method thereof, and a display device. Background technique [0002] At present, the preparation process of an organic light emitting diode display device generally includes: figure 1 and figure 2 As shown, the display backplane is produced first, and the display backplane includes a substrate 1, electronic devices and alignment marks 3 formed on the substrate 1, and then a light-emitting unit is continuously formed on the side of the substrate where the electronic devices and alignment marks 3 are formed. Then carry out the module process, use a microscope to observe and identify the position of the alignment mark 3 from the side of the substrate 1 facing away from the electronic device and the alignment mark 3, and then bind modules such as flexible circuit boards on the display backplane. [0003] However, when the surface of the substra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/00H01L51/56H10K99/00
CPCH01L21/02H10K59/12H10K71/00H10K71/191H01L27/1218H01L27/1296
Inventor 薛智勇白妮妮彭利满刘亮亮张倩倩刘淑杰李海龙马玲玲米红玉刘旭陈强景国栋
Owner BOE TECH GRP CO LTD