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Method for reducing fitting alignment error

An error and material bonding technology, which is applied in the field of test strip production and design, can solve problems such as poor fitting tails, and achieve the effect of reducing errors and improving product accuracy and yield.

Inactive Publication Date: 2019-05-10
SINOCARE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When one of the materials has an extreme positive deviation and the other has an extreme negative deviation and needs to be bonded, it is easy to meet the accuracy requirements at the beginning of the bonding, but there is a bad situation at the end of the bonding

Method used

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  • Method for reducing fitting alignment error
  • Method for reducing fitting alignment error

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Embodiment Construction

[0019] In order to enable those skilled in the art to better understand the technical solution in the application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the drawings in the embodiment of the application. Obviously, the described implementation Examples are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0020] It should be noted that when an element is referred to as being "fixed" or "disposed on" another element, it may be directly disposed on another element or indirectly disposed on another element; when an element is referred to as being "connected" It may be directly connected to another element or indirectly connected to another element.

[0021] It i...

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Abstract

The invention discloses a method for reducing a fitting alignment error. The method comprises the following steps: setting and selecting a first marking point and a second marking point on a base plate; calculating and selecting a central point of the base plate on a connecting line between the first marking point and the second marking point; setting and selecting a third marking point and a fourth marking point on a fitting material; calculating and selecting a to-be-fitted central point of the connecting line between the third marking point and the fourth marking point; setting a straight line of the first marking point and the second marking point as a first marking line; setting the straight line of the third marking point and the fourth marking point as a second marking line; coinciding the first marking line and the second marking line by operating the base plate and the fitting material; coinciding the central point of the base plate and the to-be-fitted central point by operating the base plate and the fitting material. According to the method for reducing the fitting alignment error provided by the invention, the defect that the fitting initiating part meets the accuracyrequirement but the fitting tail part is under adverse situation can be overcome, the error while fitting two materials can be reduced, and product precision and yield can be increased.

Description

technical field [0001] The present application relates to the technical field of test strip production design, and more specifically, relates to a method for reducing errors in lamination and alignment. Background technique [0002] Traditionally, the bonding method of the pad layer of the test strip is manual bonding, which has the disadvantages of low efficiency and non-uniform bonding positions. [0003] In order to improve this situation, automatic lamination equipment has been developed, which uses visual alignment to improve lamination accuracy. Since the bonding material is printed and the base material is laser processed, there will be cumulative errors in the actual product. When one of the materials has an extreme positive deviation and the other has an extreme negative deviation and needs to be bonded, it is easy to meet the accuracy requirements at the beginning of the bonding, but there is a bad situation at the end of the bonding. [0004] Therefore, how to p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/00B32B38/18
Inventor 何志祥杨如树
Owner SINOCARE