A mobile device for bonding gold wire with shock-absorbing function

Abstract

The invention discloses a mobile device for a gold bonding wire and with a damping function. The mobile device comprises a mobile device body, a supporting frame, universal wheels, a baseplate, an enclosure plate and a damping storage box. Since fixing frame springs are compressed and then released, the springs can absorb vibration caused by the universal wheels on a steep plane, the bottom of aninner box is riveted to a third hinge base through a second hinge base and a connection rod, the inner box cannot be separated from the baseplate in the up-down movement process, and the advantages are achieved that the springs provide buffer for the inner box, so that the inner box is stable, and acute shaking of the inner box is reduced; meanwhile, interlayer plates are inserted in the inner side face of the inner box, after bumps are completely inserted in a convex edge of the top of the inner box, the hand is separated from buckles, under the application force of the second springs, the outer sides of the buckles tightly fit the convex edge of the inner side of the top of the inner box, and movable partition plates freely divide the inner space of the inner box and are conveniently inserted and stored in the inner box.

Description

technical field [0001] The invention relates to the related field of mobile devices, in particular to a mobile device for bonding gold wires with a shock-absorbing function. Background technique [0002] In integrated circuits and semiconductor devices, the bonding gold wire is used as a connecting wire to connect the semiconductor chip to the outside. This connection is completed by thermocompression ball bonding or ultrasonic thermocompression ball bonding, so this gold wire is also called ball bonding. Gold wire, due to the characteristics of integrated circuit production, this connection requires high-speed and reliable completion, the bonding gold wire is valuable and the bonding gold wire has a small diameter, and the bonding gold wire is prone to violent vibration after passing through the concave-convex plane. However, the traditional bonding gold wire The mobile device is prone to violent vibration when passing through the concave-convex plane bonding gold wire duri...

AI Technical Summary

Problems solved by technology

[0002] In integrated circuits and semiconductor devices, the bonding gold wire is used as a connecting wire to connect the semiconductor chip with the outside. This connection is completed by thermocompression ball bonding or ultrasonic thermocompression ball bonding, so this gold wire is also called ball bonding. Gold wire, due to the characteristics of integrated circuit production, this connection requires high-speed and reliable completion, the bonding gold wire is valuable and the bonding gold wire has a small diameter, and the bonding gold wire is prone to violent vibration after passing through the concave-convex plane. However, the traditional bonding gold wire is used The mobile device is prone to violent vibration when passing through the concave-convex plane bonding gold wire during the transportation process, without effective buffering and shock absorption, resulting in friction and bumping of the mixed bonding gold wire, which affects the ductility of the bonding gold wire; Bonding wires of other materials are mixed, resulting in confusion after handling of bonding gold wires and bonding wires of other materials

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