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A vertical continuous electroplating equipment

A vertical continuous electroplating and equipment technology, applied in the direction of electrolysis components, electrolysis process, etc., can solve problems such as continuous and stable production lines

Active Publication Date: 2020-07-07
东莞市佳凡智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the electroplating process of circuit board substrates, many processes are still separated, and there is no complete, continuous and stable production line

Method used

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  • A vertical continuous electroplating equipment
  • A vertical continuous electroplating equipment
  • A vertical continuous electroplating equipment

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Experimental program
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Embodiment Construction

[0031] The present invention will be further described below in conjunction with embodiment.

[0032] Such as Figure 1-14 , a vertical continuous electroplating equipment, including a frame 1, a pre-plating treatment tank 2, an electroplating tank 3, a post-plating treatment tank 4, an automatic feeding device 5, a substrate conveying device 6, a substrate guiding device 7, and an electroplating tank stop Water device 8, automatic unloading device 9, the pre-plating treatment tank 2, electroplating tank 3, post-plating treatment tank 4, automatic feeding device 5, substrate conveying device 6, substrate guiding device 7, electroplating tank water retaining Device 8 and automatic unloading device 9 are all installed on the frame 1; the pre-plating treatment tank 2, the electroplating tank 3 and the post-plating treatment tank 4 are fixed on the middle section of the frame 1, and the automatic feeding The device 5 is fixed in front of the pre-plating treatment tank 2, and the ...

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Abstract

The invention relates to the technical field of technical electroplating equipment, in particular to vertical continuous electroplating equipment. The vertical continuous electroplating equipment comprises a machine frame, an electroplating pretreatment tank, an electroplating tank, an electroplating post-treatment tank, an automatic feeding device, a substrate conveying device, a substrate guiding device, an electroplating tank water blocking device and an automatic discharging device. The electroplating pretreatment tank, the electroplating tank and the electroplating post-treatment tank arefixed to the upper part of the machine frame, the automatic feeding device is fixed in front of the electroplating pretreatment tank, and the automatic discharging device is fixed behind the electroplating post-treatment tank. The substrate conveying device is fixed to the upper parts of the automatic feeding device, the electroplating post-treatment tank, the electroplating tank, the electroplating post-treatment tank and the automatic discharging device in a stretching across mode, and the substrate guiding device is fixed in the electroplating pretreatment tank, the electroplating tank andthe electroplating post-treatment tank in a stretching across mode and is positioned below the substrate conveying device. The vertical continuous electroplating equipment has high practicability andis suitable for popularization in the field.

Description

technical field [0001] The invention relates to the technical field of electroplating equipment, in particular to a vertical continuous electroplating equipment. Background technique [0002] Electroplating is a very important process in the production process of circuit board substrates. The thickness of the substrate is very thin, which is the same as the thickness of paper. The production process of the substrate includes feeding, pre-treatment, electroplating, post-processing and blanking. In the automatic production system, the material is too light, too soft, and too thin, all of which bring great difficulties to the two links of loading and unloading. The phenomenon of overlapping feeding of two substrates causes the substrates to be in an overlapping state in the subsequent processes, which affects the qualified rate of substrate electroplating. During the conveying process of the substrate in each section of the tank, if there is no guidance, the substrate will flu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D19/00C25D17/00
Inventor 罗运浪
Owner 东莞市佳凡智能科技有限公司