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Mold

A mold and template technology, applied in the field of molds, can solve problems such as large mold space and reduced mold size

Active Publication Date: 2019-05-31
YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the mold can be used to process products with buckle structure. Usually, the buckle structure is processed by using the undercut groove on the ejector rod. The ejector pin is also inclined. The ejector pin slides obliquely along the ejector groove to eject the product and is separated from the buckle structure on the product. However, the matching structure between the ejector groove and the ejector rod occupies a large mold space, which is not conducive to reducing Die size

Method used

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Embodiment Construction

[0024] see figure 1 , figure 2 and image 3 , the embodiment of the present invention provides a mold 100 , and the mold 100 includes a template 10 and an ejector assembly 20 . The template 10 is provided with a mold cavity 11 and an ejection groove 12 communicated with the mold cavity 11, the mold cavity 11 is used for forming a product 200, and the template 10 is provided with a first ejection groove 12 in the ejection groove 12. Inclined wall 121 . The ejector assembly 20 includes an ejector rod 21 slidingly fitted with the ejector groove 12, the length direction of the ejector rod 21 is parallel to the mold opening direction of the template 10, and the ejector rod 21 is between two ends A first oblique shoulder 211 matching the first inclined wall 121 is provided, and an undercut groove 212 is provided at the end of the push rod 21 . The undercut groove 212 shrinks in the ejection groove 12 along with the ejector rod 21 to form the undercut 25 on the product 200, and ...

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Abstract

The invention provides a mold comprising a mold plate and an ejection assembly. The mold plate is provided with a mold cavity and an ejection groove communicating with the mold cavity, the mold cavityis used for molding a product, a first inclined wall is arranged in the ejection groove of the mold plate, the ejection assembly includes an ejection rod in sliding fit with the ejection groove, thelength direction of the ejection rod is parallel to the mold opening direction of the mold plate, and a first oblique shoulder matched with the first inclined wall is arranged between the two ends ofthe ejection rod; a reverse buckle groove is formed in the end of the ejection rod, and the reverse buckle groove contracts back into the ejection groove along with the ejection rod to form a reversebuckle on the molded product; and when the ejection rod extends out of the ejection groove to eject out the product, the first oblique shoulder slides along with the ejection rod to get close to and abut against the first inclined wall, the mold plate conducts sliding guide on the ejection rod through the first inclined wall, and therefore the ejection rod slides out of the ejection groove in thedirection parallel to the mold opening direction of the mold plate and meanwhile slides in the direction vertical to the mold opening direction of the mold plate to make the reverse buckle break awayfrom the reverse buckle groove. The length direction of the ejection rod is parallel to the mold opening direction of the mold plate, the ejection rod and the ejection groove occupy a small space, andthe size of the mold is better reduced.

Description

technical field [0001] The invention relates to the technical field of molds, in particular to a mold. Background technique [0002] At present, the mold can be used to process products with buckle structure. Usually, the buckle structure is processed by using the undercut groove on the ejector rod. The ejector pin is also inclined. The ejector pin slides obliquely along the ejector groove to eject the product and is separated from the buckle structure on the product. However, the matching structure between the ejector groove and the ejector rod occupies a large mold space, which is not conducive to reducing Die size. Contents of the invention [0003] An embodiment of the present invention provides a mold. The mold includes a template and an ejection assembly. A first inclined wall is provided in the ejection groove, and the ejection assembly includes a ejector rod that slides with the ejection groove, and the length direction of the ejector rod is parallel to the mold ...

Claims

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Application Information

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IPC IPC(8): B29C45/26B29C45/44B29C45/40
Inventor 刘均平
Owner YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD