Hot melt adhesive tape organic molecular composition

A technology of organic molecules and hot-melt tapes, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problem of affecting the use effect, increasing the difficulty of construction, and easy bonding of colloidal particles, etc. problem, to achieve the effect of reducing construction difficulty and stickiness

Inactive Publication Date: 2019-05-31
DONGGUAN AOZON ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the product itself is solid, it is convenient for packaging, transportation, storage, solvent-free, non-polluting, and non-toxic; and it has the advantages of simple production process, high added value, strong bonding strength, and fast speed; The melted rubber sheet

Method used

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  • Hot melt adhesive tape organic molecular composition
  • Hot melt adhesive tape organic molecular composition
  • Hot melt adhesive tape organic molecular composition

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0018] Example 1

[0019] A hot-melt adhesive tape organic molecular composition, the composition comprising the following parts by weight of raw materials:

[0020]

[0021] EVA resin includes EVA800 and EVA900, and the component ratio of EVA800 and EVA900 is 2:1.

[0022] Wax is microcrystalline wax.

[0023] The initiator is one of benzoyl peroxide and azobisisobutyronitrile.

[0024] The filler is at least one of calcium carbonate, talc, silica powder and color masterbatch.

[0025] A preparation method of an organic molecular composition of a hot melt adhesive tape, the preparation method comprising the following steps:

[0026] S1: Add EVA resin, maleic anhydride monomer, wax, initiator, dispersant, plasticizer, polypropylene resin, polyisobutylene, filler, antioxidant and SBS into the reactor in sequence to melt, mix and stir, the melting temperature is 150 ℃, get a mixture;

[0027] S2: Add the mixture in S1 to the extruder for melt extrusion;

[0028] S3: The rubber strip extruded...

Example Embodiment

[0030] Example 2

[0031] A hot-melt adhesive tape organic molecular composition, the composition comprising the following parts by weight of raw materials:

[0032]

[0033] EVA resin includes EVA800 and EVA900, and the component ratio of EVA800 and EVA900 is 2:1.

[0034] Wax is microcrystalline wax.

[0035] The initiator is one of benzoyl peroxide and azobisisobutyronitrile.

[0036] The filler is at least one of calcium carbonate, talc, silica powder and color masterbatch.

[0037] A preparation method of an organic molecular composition of a hot melt adhesive tape, the preparation method comprising the following steps:

[0038] S1: Add EVA resin, maleic anhydride monomer, wax, initiator, dispersant, plasticizer, polypropylene resin, polyisobutylene, filler, antioxidant and SBS into the reactor in sequence to melt, mix and stir, the melting temperature is 165 ℃, get a mixture;

[0039] S2: Add the mixture in S1 to the extruder for melt extrusion;

[0040] S3: The rubber strip extruded...

Example Embodiment

[0042] Example 3

[0043] A hot-melt adhesive tape organic molecular composition, the composition comprising the following parts by weight of raw materials:

[0044]

[0045]

[0046] EVA resin includes EVA800 and EVA900, and the component ratio of EVA800 and EVA900 is 2:1.

[0047] Wax is microcrystalline wax.

[0048] The initiator is one of benzoyl peroxide and azobisisobutyronitrile.

[0049] The filler is at least one of calcium carbonate, talc, silica powder and color masterbatch.

[0050] A preparation method of an organic molecular composition of a hot melt adhesive tape, the preparation method comprising the following steps:

[0051] S1: Add EVA resin, maleic anhydride monomer, wax, initiator, dispersant, plasticizer, polypropylene resin, polyisobutylene, filler, antioxidant and SBS into the reactor in order to melt, mix and stir, and the melting temperature is 180 ℃, get a mixture;

[0052] S2: Add the mixture in S1 to the extruder for melt extrusion;

[0053] S3: The rubber stri...

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Abstract

The invention discloses a hot melt adhesive tape organic molecular composition which comprises, by weight, 30-60 parts of EVA resin, 10-20 parts of maleic anhydride monomer, 10-20 parts of wax and 5-10 parts of initiator. By mixing EVA800 with EVA900 according to a proportion of 2:1, hardness and softening point can be neutralized, and sensitivity of a film to temperature can be lowered; emulsified wax is added into a water tank, an adhesive tape is cooled and shaped in the water tank, a layer of wax coats the outer layers of colloidal particles, the surface of a hot melt adhesive after granulation is smooth, dry and comfortable, and the colloidal particles are less prone to adhesion, so that when outside temperature goes up, sensitivity of the colloidal particles to temperature is lowest;in this way, during transporting and warehousing in hot summer, softening of the hot melt adhesive is unobvious due to temperature rise, sticking is good, and the colloidal particles do not bond together, so that construction difficulty is lowered, and no actual impact is exerted on using effect.

Description

Technical field [0001] The invention relates to the technical field of hot melt adhesives, in particular to a hot melt adhesive tape organic molecular composition. Background technique [0002] Hot melt adhesive is a kind of plastic adhesive. Its physical state changes with temperature within a certain temperature range, while its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. Because the product itself is solid, it is easy to package, transport, store, solvent-free, pollution-free, non-toxic; and the production process is simple, high value-added, high bonding strength, fast speed, etc., it is favored; the existing heat Fusible film is too sensitive to the outside temperature and is easier to soften, causing the rubber particles to easily bond together when they are transported and used at high temperatures, which increases the difficulty of construction and affects the use effect. Summary of the inventi...

Claims

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Application Information

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IPC IPC(8): C09J123/08C09J123/12C09J123/20C09J153/02C09J11/04C09J11/08
Inventor 崔进王宜金覃飞飞
Owner DONGGUAN AOZON ELECTRONICS MATERIAL
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