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The invention discloses a simulation design method for a 5G high-speed fan

A technology of simulation design and simulation calculation, applied in calculation, image data processing, special data processing applications, etc., can solve the problems of rising R&D costs, fan structure weight and wind noise cannot be estimated, mold costs, proofing costs and test costs increase, etc. , to achieve the effects of shortening the R&D cycle, improving simulation computing capabilities, and optimizing product structure

Active Publication Date: 2019-05-31
CHANGZHOU GIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Increased heat dissipation coefficient will lead to unpredictable weight of the fan structure and wind noise. The launch of the product requires multiple product tests, resulting in increased mold costs, proofing costs, and test costs. R&D costs have risen sharply, and the current product R&D cycle Longer, unable to keep up with the strong R&D needs of customers

Method used

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  • The invention discloses a simulation design method for a 5G high-speed fan
  • The invention discloses a simulation design method for a 5G high-speed fan
  • The invention discloses a simulation design method for a 5G high-speed fan

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Embodiment Construction

[0023] If it is necessary to design a 5G fan whose structural strength meets the requirement of fan speed of 30,000 rpm, good heat dissipation performance and good acoustic performance, the following design steps are carried out according to the present invention (see figure 1 ):

[0024] A. Carry out product structure design, carry out 3D modeling, and form a 3D model;

[0025] B. Input the required structural strength standard, air volume standard and noise standard in the calling software program;

[0026] C. Call the software program to input the three-dimensional model into the structural strength analysis software, select the material according to the following table, and input the technical parameters of the material;

[0027]

[0028]

[0029] D. Use structural strength analysis software to analyze the structural strength of the 3D model, and obtain the following results:

[0030]

[0031] Among them, the materials with safety factor S greater than 1.8 are 1...

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Abstract

The invention relates to a simulation design method for a 5G high-speed fan, and the method comprises the following steps: A, carrying out the product structure design, carrying out the three-dimensional modeling, and forming a three-dimensional model; B, inputting a required structure strength standard, a required air volume standard and a required noise standard into the calling software program; C, inputting the three-dimensional model into structural strength analysis software by utilizing a calling software program, and inputting technical parameters of a material; D, structural strengthanalysis is conducted on the three-dimensional model through structural strength analysis software; E, the three-dimensional model meeting the structural strength standard is input into air volume analysis software for air volume analysis by calling a software program; And F, the three-dimensional model meeting the air volume standard is input into noise analysis software for noise analysis by calling a software program, and a final design scheme is obtained. Through the method, the research and development period of the 5G high-speed fan can be greatly shortened, and the requirements of customers are met to the maximum extent.

Description

technical field [0001] The invention relates to a manufacturing method of a fan and a simulation design method of a 5G high-speed fan. Background technique [0002] With the advent of the 5G era, the power of wireless communication network ports of electronic products will rise sharply, and it is necessary to improve the cooling efficiency of the cooling system. Increased heat dissipation coefficient will lead to unpredictable weight of the fan structure and wind noise. The launch of the product requires multiple product tests, resulting in increased mold costs, proofing costs, and test costs. R&D costs have risen sharply, and the current product R&D cycle Long, unable to keep up with the strong research and development needs of customers. Contents of the invention [0003] The purpose of the present invention is to provide a simulation design method of a 5G high-speed fan, which can greatly shorten the research and development cycle and reduce research and development in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50G06T17/00
CPCY02T90/00
Inventor 苏绍华王友聪邬均文王明喜
Owner CHANGZHOU GIAN TECH
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