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Display panel border encapsulation method and display panel

A technology for a display panel and a packaging method, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., to prevent water vapor intrusion, meet the requirements of packaging life, and improve packaging effects.

Active Publication Date: 2019-06-04
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The disclosure provides a display panel frame packaging method and a display panel for solving the problems of the prior art

Method used

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  • Display panel border encapsulation method and display panel
  • Display panel border encapsulation method and display panel
  • Display panel border encapsulation method and display panel

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Embodiment Construction

[0034] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present disclosure may be practiced. The directional terms mentioned in this disclosure, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are for reference only The orientation of the attached schema. Therefore, the directional terms used are used to explain and understand the present disclosure, but not to limit the present disclosure. In the figures, structurally similar elements are denoted by the same reference numerals.

[0035] The disclosure will be further described below in conjunction with the accompanying drawings and specific embodiments:

[0036] This disclosure provides a display panel frame packaging method, combined with the following Figure 1 to Figure 8 Describe in detail.

[0037] Such as figure 1 as shown, figure 1 A schematic flowchart of a display panel frame pac...

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Abstract

The invention provides a display panel and a display panel border encapsulation method. The display panel includes a first substrate and a second substrate. A display device layer is arranged on the first substrate, and multiple retaining walls are arranged in a spaced manner on the two sides of the display device layer. The second substrate is arranged on the first substrate. A filling glue layeris arranged on one side of the second substrate near the first substrate. Glass glue is arranged on the two sides of the filling glue layer. The glass glue is compact enough to reduce the border width of the display panel. The edge connection part between the first substrate and the second substrate is coated with sealing glue, which penetrates into the pores and cracks formed by the sintering ofthe glass glue to prevent the intrusion of water vapor. Therefore, the encapsulation effect of the display panel is improved, and the encapsulation life requirement of the display panel is satisfied.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel frame packaging method and a display panel. Background technique [0002] At present, the packaging methods of large-size Organic Light-Emitting Diode (OLED) display panels mainly include surface-mounted packaging, frame glue, moisture absorbent, and filler packaging. Generally, there are 3- With a distance of 4mm, the width of the frame adhesive and moisture absorbent is about 2mm, so whether it is a surface-mounted package or a frame adhesive, moisture absorbent, and filler package, it is difficult to form a narrow frame package less than 2mm. For small-sized OLED devices, glass glue packaging is usually used for packaging, but because large-sized display panels have higher requirements on life, after laser sintering, there will be some pores and cracks, which provide water vapor intrusion channels , making the encapsulation effect worse. Therefore, glass glu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K59/87
Inventor 杨中国
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD