High-strength heat radiation type hardware backboard and production technology thereof

A heat-dissipating, high-strength technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as insufficient strength and no heat dissipation function of the backplane

Inactive Publication Date: 2019-06-28
东莞市鑫米电子科技有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a high-strength heat-dissipating metal backplane and its production process, which can effectively solve the problem that the existing backplane does not have a heat dissipation function and has insufficient strength. question

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  • High-strength heat radiation type hardware backboard and production technology thereof
  • High-strength heat radiation type hardware backboard and production technology thereof

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Embodiment Construction

[0028] Please refer to figure 1 with figure 2 As shown, it shows the specific structure of the preferred embodiment of the present invention, including a heat dissipation frame 10 , a heat dissipation cover 20 , a reinforcement cover 30 and a plurality of heat pipes 40 .

[0029] The heat dissipation frame 10 is made of aluminum alloy, and includes a main frame 11, which is in the shape of a hollow truncated cone, and has a truncated cone-shaped accommodation space 101. Radiating fin group 12, the upper cooling fin group 12 is provided with a plurality of horizontally arranged upper jacks 102, the upper side of the upper cooling fin group 12 is flush with the upper side of the main frame 11, and the upper cooling fin group The rear side of the group 12 is flush with the rear side of the reinforced cover plate 30 to make full use of the space; the bottom inclined surface of the main body frame 11 extends integrally with a lower cooling fin group 13, and the lower cooling fin ...

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Abstract

The invention discloses a high-strength heat radiation type hardware backboard and production technology thereof. The hardware backboard comprises a heat radiation frame, a heat radiation cover plate,a reinforcing cover plate and heat conduction tubes; and the heat radiation frame comprises a body frame of a hollow frustum shape and with a frustum-shaped accommodating space, an upper radiating fin group is extended out of the top inclined plane of the body frame in an integrated way, upper jacks arranged horizontally are formed in the upper radiating fin group, and a lower radiating fin groupis extended out of the bottom inclined plane of the body frame. The upper and lower radiating fin groups are extended from the top and bottom inclined planes of the body frame respectively, the spaceis utilized fully, the heat radiation cover plate and the heat conduction tubes are arranged cooperatively, so that the backboard has a good heat radiation effect, and the operational stability and reliability of display equipment are improved; and the reinforcing cover plate is arranged, so that the total strength of the backboard is improved, the backboard is unlikely to deformation and damage,and the service life is longer.

Description

technical field [0001] The invention relates to the technology in the field of hardware backplanes, in particular to a high-strength heat dissipation hardware backplane and its production process. Background technique [0002] The backplane is usually used to cover and install on the back of the display device (such as a display screen, TV, etc.) to prevent dust; the current backplane is mainly a shell with hollow upper and lower parts formed by stamping of hardware materials. Body, this kind of backplane structure does not have the function of heat dissipation, the function is relatively single, and the strength is not enough, and it is easy to be deformed and damaged. Therefore, it is necessary to improve the current backplane. Contents of the invention [0003] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a high-strength heat-dissipating metal backplane and its production process, which can effecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 朱正康朱胜迁
Owner 东莞市鑫米电子科技有限公司
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