Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and system for prolonging service life of mainboard chip and storage medium

A technology of life and chip, applied in the field of Android intelligent system, can solve the problems of limited service life of the main chip, the main chip cannot work normally, shorten the service life of the main chip, etc., and achieve the effect of avoiding the loss of service life.

Active Publication Date: 2019-07-05
SHENZHEN TCL NEW-TECH CO LTD
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when more and more applications are installed in an electronic device, it is often a test for the main chip of the device, because the service life of each main chip is limited. When the amount of writing reaches the upper limit of the main chip, the main chip chip will not work
Therefore, if the user installs it or the main program of the device itself has a large amount of write data, it will greatly shorten the service life of the main chip, cause the customer's property loss, and cause customer dissatisfaction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and system for prolonging service life of mainboard chip and storage medium
  • Method and system for prolonging service life of mainboard chip and storage medium
  • Method and system for prolonging service life of mainboard chip and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] With the rapid development of network technology and smart technology, smart system devices, such as smart TVs, smart phones, etc., are rapidly popularized. Convenience, but also greatly enriched people's lives. But the more applications installed on an electronic device, the more severe the test is for the main chip of the device. Because the computing power of each main chip is limited, the more applications installed, the higher the computing power requirements for the main chip. All applications need to write data to the main chip. When the amount of data written to the main...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a system for prolonging the service life of a mainboard chip and a storage medium, which are used for prolonging the service life of the mainboard chip. The methodcomprises the following steps: opening a node function of obtaining process writing in the kernel of the operating system; creating a process for monitoring EMMC data of the embedded multimedia card;and enabling the monitoring process to monitor the capacity of the EMMC data of each process in a set time period so as to obtain and store node information and total node data, and to analyze and judge abnormal node information data in the node information data and repair the abnormal node information data. Through the measures, the problem that a main chip can still work when the data volume written into the memory EMMC reaches the upper limit of the main chip and the service life is not affacted.

Description

technical field [0001] The invention relates to Android intelligent system technology, in particular to a method, system and storage medium for improving the service life of a motherboard chip. Background technique [0002] With the rapid development of Internet technology, various smart system devices continue to popularize, and the development of various APKs (Android Packages, that is, Android installation packages) brings more convenience and fun to people's lives. However, when more and more applications are installed in an electronic device, it is often a test for the main chip of the device, because the service life of each main chip is limited. When the amount of writing reaches the upper limit of the main chip, the main chip The chip will not work properly. Therefore, if the user installs it or the main program of the device itself has a large amount of write data, it will greatly shorten the service life of the main chip, cause the customer's property loss, and ca...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/30G06F11/07
CPCG06F11/3031G06F11/0796
Inventor 詹翠丹
Owner SHENZHEN TCL NEW-TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com