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Wearable device

A wearable device and chip technology, applied in the direction of electrical components, circuits, printed circuits, etc., can solve the problem of low utilization rate of circuit boards

Inactive Publication Date: 2019-07-05
GUANGDONG XIAOTIANCAI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a wearing device to solve the technical problem of low utilization of the surface of the circuit board in the prior art

Method used

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Examples

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Embodiment 1

[0025] figure 1 and figure 2 They are the first internal structure and the second internal structure diagram of a wearable device provided in Embodiment 1 of the present application. This embodiment is applicable to various wearable devices, such as smart glasses and smart watches. The device specifically includes a main circuit board 10 and a main controller 20, and also includes a first chip or a second chip, and the first chip and the second chip are chips with different functions;

[0026] The main circuit board 10 is provided with a general-purpose pad group 30, at least one pad in the general-purpose pad group 30 is defined as a signal input pad, and at least one pad in the general-purpose pad group 30 is defined as a signal input pad. An output pad, at least one pad in the general-purpose pad group 30 is defined as a ground pad;

[0027] The first chip and the second chip include signal input pins, signal output pins and ground pins, and the pin layout after packagin...

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Abstract

The embodiment of the invention discloses a wearable device. The wearable device comprises a main circuit board, a main controller, a first chip or a second chip, wherein the first chip and the secondchip are chips with different functions; the main circuit board is provided with a universal pad group, at least one pad in the universal pad group is defined as a signal input pad, at least one padin the universal pad group is defined as a signal output pad, and at least one pad in the universal pad group is defined as a ground pad. The first chip and the second chip comprise a signal input pin, a signal output pin and a ground pin, and the pin layout after packaging is the same; when the first chip or the second chip is welded to the main circuit board, the pin of the first chip or the second chip is welded corresponding to the pad group, and the transmission of input signals and output signals is performed between the pads in the pad group and the main controller. Chips with differentmounting functions are selected on the universal pad group according to specific design, and the area of the main circuit board is efficiently achieved.

Description

technical field [0001] The embodiments of the present application relate to the technical field of hardware electronics, and in particular, to a wearable device. Background technique [0002] With the development of electronic technology, there are more and more types of consumer electronic products, and the shapes are becoming more and more abundant. Moreover, with the accumulation of various functions on electronic products, the corresponding structural design is becoming more and more complex. Utilization requirements are getting higher and higher. [0003] In the existing wearable equipment, the radio frequency circuit is the basic circuit module for electronic equipment to realize the communication function. In the radio frequency circuit, LTCC (Low Temperature Co-fired Ceramic, low temperature co-fired ceramic) filter or acoustic surface filter can be used for Filtering, in a specific wearable device, only one of the LTCC filter and the surface acoustic wave filter is...

Claims

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Application Information

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IPC IPC(8): H05K1/11H01L25/16
CPCH01L25/16H05K1/111
Inventor 徐逸
Owner GUANGDONG XIAOTIANCAI TECH CO LTD
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