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Heat dissipation plate, heat dissipation assembly, electronic device and manufacturing method of heat dissipation plate

A manufacturing method and technology of heat dissipation components, applied in the field of electronic communication, can solve the problems of fault, capillary structure heat dissipation plate falling off, reducing capillary force and the like

Inactive Publication Date: 2019-07-05
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The capillary structure of the above structure is easily affected by external conditions. For example, when the heat sink is squeezed, the capillary structure is easy to fall off from the heat sink and cause faults, which reduces the capillary force and affects the heat dissipation effect of the heat sink.

Method used

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  • Heat dissipation plate, heat dissipation assembly, electronic device and manufacturing method of heat dissipation plate
  • Heat dissipation plate, heat dissipation assembly, electronic device and manufacturing method of heat dissipation plate
  • Heat dissipation plate, heat dissipation assembly, electronic device and manufacturing method of heat dissipation plate

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Embodiment Construction

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0028] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phr...

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Abstract

The invention discloses a heat dissipation plate, which comprises a first substrate, a second substrate and support columns, wherein one side of the first substrate is integrally molded with a capillary structure, and the capillary structure is the same as the first substrate in material; the second substrate is arranged at the side, where the capillary structure is arranged, of the first substrate and laminated with the first substrate; and the support columns are formed between the first substrate and the second substrate and enable the first substrate and the second substrate to form an accommodating cavity therebetween. By adopting the above structure, the capillary structure is integrated with the first substrate rather than attached to the first substrate. It is not the combination of two different components through a certain process, but the capillary structure itself is a part of the first substrate, so that the capillary structure does not fall off from the first substrate even if the heat dissipation plate is deformed by force, the capillary force of the capillary structure is ensured, and the heat dissipation effect of the heat dissipation plate is guaranteed. The invention further provides a heat dissipation assembly including the heat dissipation plate, an electronic device including the heat dissipation assembly and a manufacturing method of the heat dissipationplate.

Description

technical field [0001] The present application relates to the technical field of electronic communication, and in particular to a heat dissipation plate, a heat dissipation assembly including the heat dissipation plate, an electronic device and a manufacturing method of the heat dissipation plate. Background technique [0002] Electronic devices such as mobile phones and tablet computers are equipped with heat sinks. Generally, there is a capillary structure layer on the heat sink. The capillary structure is copper powder or metal braided mesh, which is fixed on the heat sink by sintering. The capillary structure of the above structure is easily affected by external conditions. For example, when the heat sink is squeezed, the capillary structure is easy to fall off from the heat sink and cause faults, which reduces the capillary force and affects the heat dissipation effect of the heat sink. Contents of the invention [0003] The application provides a heat dissipation pla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F28D15/04
CPCF28D15/046H05K7/20336
Inventor 贾玉虎
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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