Resin sealing mold adjusting method and resin sealing mold

A technology of resin sealing and adjustment method, which is applied to the adjustment of resin sealing molds and the field of resin sealing molds, which can solve the problems of economic burden on stamping devices, labor required for operators, and high mold prices

Active Publication Date: 2019-07-05
DAIICHI SEIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the man-hours of the work are very large, and the labor of the operator is required.
[0008] Furthermore, since molds are expensive, preparing mo

Method used

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  • Resin sealing mold adjusting method and resin sealing mold
  • Resin sealing mold adjusting method and resin sealing mold
  • Resin sealing mold adjusting method and resin sealing mold

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0046] The first embodiment described below is an example in which the height of the cavity is adjusted by replacing the spacer 50 with another spacer 51 from a state in which the spacer 50 is installed in the upper mold 1 . Therefore, in the first embodiment, first, the structure of the upper mold 1 incorporating the spacer 50 (refer to figure 1 ) and the structure when using the upper mold 1 to close the mold (refer to figure 2 )Be explained. Then, the change from the spacer 50 to the spacer 51 and the structure of the upper mold 1 replaced by the spacer 51 (refer to Figure 4 ), the structure when using the upper mold 1 changed to the spacer 51 for mold clamping (refer to Figure 5 )Be explained.

[0047] figure 2 It is a schematic diagram for explaining an example of a mold for resin sealing to which the present invention is applied, and the mold A shown here is composed of an upper mold 1 and a lower mold 2 (see figure 2 ). The upper mold 1 and the lower mold 2 a...

no. 2 approach

[0081] Next, a second embodiment of the mold for resin sealing to which the present invention is applied will be described. In addition, in the following, detailed descriptions of the configurations that overlap with those of the first embodiment that have already been described will be omitted, and the configurations that differ from those of the first embodiment will be mainly described.

[0082] Such as Figure 6 and Figure 7 As shown, in the second embodiment of the resin sealing mold to which the present invention is applied, in the structure of the upper mold 101, the same as the above-mentioned upper mold 1, the holder base 120 uses the spring member 121 to hold the package insert 140 Keep it so that it does not fall off downward.

[0083] In addition, the upper mold 101 is different from the upper mold 1 in that no flange receiving portion is provided on the bottom plate 130 and no flange portion is provided on the connector 141 . That is, the upper mold 101 has a ...

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PUM

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Abstract

To provide a resin sealing mold adjusting method and a resin sealing mold which are capable of easily coping with a change in the thickness of a resin molding part, in a resin sealing package. According to the present invention, an upper mold 1 is composed of an upper mold die set 11 and an upper mold chess 12. The upper mold die set 11 is a member which supports the upper mold chess 12. In addition, the upper mold chess 12 has a holder base 20, a base plate 30, and a package insert 40. Spring members 60 are disposed between the holder base 20 and the base plate 30 and downwardly bias the holder base 20 and the package insert 40.

Description

technical field [0001] The present invention relates to an adjustment method of a mold for resin sealing and a mold for resin sealing. Background technique [0002] Conventionally, insert molding for manufacturing a resin-sealed package by sealing electronic components such as semiconductors with resin has been performed. In this insert molding, an electronic component or a substrate with an electronic component is fixed inside a mold, molten resin is filled into the cavity and hardened, and the substrate with an electronic component and the like are integrated with the resin molded part. [0003] In addition, depending on the type of the resin-sealed package, products having different thicknesses of the portion where the resin is formed on the surface of the electronic component (hereinafter referred to as “resin molded portion”) are manufactured. In order to cope with the change in the thickness of the resin molded part, in the conventional resin sealing device, the entir...

Claims

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Application Information

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IPC IPC(8): B29C45/26
CPCB29C45/26B29C45/14655B29C45/1468B29C45/376H01L21/565H01L21/67126H01L23/28
Inventor 宫原宏明
Owner DAIICHI SEIKO CO LTD
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