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Camera Module Test Set

A technology of camera module and test device, which is applied in the direction of measuring device, measuring device shell, electronic circuit test, etc., can solve the problems of impossible test, large noise, etc., and achieve the effect of improving reliability

Active Publication Date: 2020-12-29
LEENO IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, high frequency testing creates a lot of noise between the signal probes of each row, making it impossible to test

Method used

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  • Camera Module Test Set
  • Camera Module Test Set
  • Camera Module Test Set

Examples

Experimental program
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Embodiment Construction

[0022] Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

[0023] The camera module testing apparatus 100 checks electrical characteristics of an object under test, for example, a small camera module of a smart phone. The camera module testing apparatus 100 contacts the signal probe 110 and the ground probe 120 as figure 1 Multiple terminals of the tri-state MIPIC-PHY 10 of the illustrated camera module are tested, for example, by contact between signal probe 110 and signal terminal 12 and contact between ground probe 120 and ground terminal 14 .

[0024] Figure 2 to Figure 5 are a perspective view, an exploded perspective view, a plan view and a cross-sectional view of a camera module testing apparatus 100 according to an exemplary embodiment of the present invention. As shown in the figure, the camera module testing device 100 includes: a signal probe 110; a ground probe 120; a conductive block 130 penetrated by ...

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Abstract

A test device is disclosed, which is electrically connected to a terminal of a test object and a test terminal of a test circuit. The test device includes a signal probe, a ground probe, a conductive block and an insulating case. The conductive block is configured to include signal probe holes through which the signal probes pass without electrical contact, and ground probe holes through which the ground probes pass without electrical contact. The insulative housing is configured to receive the conductive bumps and support opposite ends of the signal probes. Therefore, noise between the signal probe and the signal terminal can be effectively shielded.

Description

technical field [0001] The present invention relates to a test device for checking electrical characteristics of an object under test, such as a camera module. Background technique [0002] Recently, mobile devices, such as smart phones, personal digital assistants (PDAs), and tablet computers, have become popular. The small camera modules used in these mobile devices include a three-state Mobile Industry Processor Interface (MIPI) C-PHY 10 . figure 1 A tri-state MIPI C-PHY 10 is shown in which a plurality of terminals 12 and 14 to be tested protrude from two parallel rows as a connector arrangement. [0003] The test setup for inspecting the camera module arranges a plurality of signal probes and ground probes in two parallel rows to contact the signal terminal 12 and the ground terminal 14 of the tri-state MIPI C-PHY 10 for testing. However, high-frequency testing creates a lot of noise between the signal probes of each row, making testing impossible. Contents of the i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N17/00H04N5/225G01R1/04G01R1/073G01R31/28
CPCH04N17/002G01R1/0416G01R31/2825H04N23/50G01R1/0408G01R1/073H04N23/57
Inventor 金熙哲
Owner LEENO IND INC