Electromagnetic wave shielding film
An electromagnetic wave, shielding film technology, applied in the fields of magnetic/electric field shielding, electronic equipment, electrical components, etc., can solve the problem that the circuit pattern cannot be visually recognized from the outside.
Active Publication Date: 2019-07-19
TATSUTA ELECTRICWIRE & CABLE
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] Research is currently under way to make the circuit pattern of the printed wiring substrate unrecognizable from the outside
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1）
[0065] The peeling film used was a PET film having a thickness of 50 μm and an 85° glossiness of 2.3. A release agent layer with a thickness of 0.7 μm was formed on the insulating protective layer side surface of the release film. The release performance of the release film was good. The 85° glossiness of the insulating protective layer after peeling off the peeling film was 9.2. Also good coverage.
Embodiment 2）
[0067] The peeling film used was a PET film having a thickness of 50 μm and an 85° glossiness of 2.3. A release agent layer with a thickness of 3.0 μm was formed on the insulating protective layer side surface of the release film. The release performance of the release film was good. The 85° glossiness of the insulating protective layer after peeling off the peeling film was 9.6. Also good coverage.
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Abstract
The invention provides an electromagnetic wave shielding film in which the glossiness of an insulating protective layer is reduced and the peelability of the release film is improved. The electromagnetic wave shielding film includes an insulating protective layer 112, a conductive adhesive layer 111, and a surface of the insulating protective layer 112 opposite to the conductive adhesive layer 111with a release agent layer 114 interposed therebetween. And a release film 115 provided. The insulating protective layer 112 has an 85 DEG glossiness of less than 15, and the 85 DEG glossiness on theinsulating protective layer side surface of the release film 115 is less than 3, and the thickness of the release agent layer 114 is less than 10 mu m.
Description
technical field [0001] The invention relates to an electromagnetic wave shielding film and a shielding circuit substrate. Background technique [0002] Research is currently under way to make the circuit pattern of the printed wiring substrate invisible from the outside. On the other hand, an electromagnetic wave shielding film for shielding electromagnetic noise is pasted on the surface of the printed wiring substrate. A black-based coloring agent is added to the insulating protective layer of the electromagnetic wave shielding film for the purpose of aesthetic appearance and improved visibility of printed characters (for example, refer to Patent Document 1). By attaching the electromagnetic wave shielding film to the printed wiring base, the circuit pattern of the printed wiring base can not be directly recognized visually. [0003] [Prior Art Literature] [0004] 【Patent Literature】 [0005] [Patent Document 1] Japanese Patent Application Publication No. 2016-143751. ...
Claims
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IPC IPC(8): B32B7/06B32B7/12B32B15/08B32B27/06B32B33/00
CPCB32B7/06B32B7/12B32B27/06B32B15/08B32B33/00B32B2307/212B32B2307/206B32B2457/08H05K9/0081H05K3/281H05K1/0218B32B7/023B32B27/36B32B2307/406
Inventor 梅村滋和渡边正博
Owner TATSUTA ELECTRICWIRE & CABLE