System for washing and drying wafer

Abstract

The invention discloses a system for washing and drying a wafer and a method for washing and drying the wafer by the system. The system comprises a system main body and a bottom support device, wherein the bottom support device is used for supporting the wafer, wafers with different sizes can be accommodated by the system main body, the bottom support device encircles a shaft to drive the wafer torotate, the system also comprises a rotation swinging arm and a bottom pipeline structure, the bottom pipeline structure is used for providing a cleaning liquid, a gas and a mixed gas for drying, andone or more wet spraying members and gas solvent spraying members are arranged at a tail end of the swinging arm and a fixed plate of the bottom support device and are used for spraying the gas and the liquid to cover an upper surface and the lower surface of the wafer. The wet spraying members and the gas solvent spraying members are arranged at the tail end of the swinging arm and the fixed plate of the bottom support device, the spraying gas and the liquid cover the upper surface and the lower surface of the whole wafer, the upper surface and the lower surface of the wafer can be effectively dried, and liquid trace is not reserved.

Description

technical field [0001] The invention belongs to the field of equipment for manufacturing semiconductor integrated circuit chips, and relates to the processing technology of drying wafers in chemical mechanical planarization equipment, in particular to a system for rinsing and drying wet wafers. Background technique [0002] As semiconductor production process technology continues to advance, the importance of ultra-clean processing continues to increase. The requirements for cleaning and drying in chemical mechanical planarization equipment (Chemical Mechanical Planarization, CMP equipment) are also increasing. In the process of drying wet wafers, one of the basic requirements is to dry the wafers and prevent any particles that were originally attached to the solution from reattaching to the wafers. If the wafer is not completely dried using a suitable method, the particles in the solution may affect the electrical characteristics of the semiconductor device, resulting in t...

AI Technical Summary

Problems solved by technology

Although this method can achieve the drying effect, it also has several obvious disadvantages: first, the drying effect of this method has not reached a high level, and the particles attached to the solution are very difficult to obtain during the high-speed centrifugation process. There may be scratches on the surface of the wafer, which will affect the performance of the wafer, and it is impossible to ensure that all attachments are removed, and a part of the particles will often remain on the surface of the wafer.

The disadvantage of this drying method is that the movement speed of the wafer will be relatively slow (in order to achieve the ideal drying effect), so the whole process will take a long time

Images