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Microsensor and its preparation method

A technology of micro-sensors and substrates, applied in the direction of micro-structure technology, micro-structure devices, manufacturing micro-structure devices, etc., can solve the problems of poor temperature uniformity in the heating area, affecting sensor performance, and long processing time, so as to achieve low cost and avoid Leakage, enhance the effect of heat dissipation

Active Publication Date: 2021-06-18
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a microsensor and its preparation method, which is used to solve the problem that the microsensor in the prior art easily causes leakage between the test loop and the heating loop, thereby affecting The problem of sensor performance, as well as the problems of poor temperature uniformity in the heating area of ​​the micro sensor, complex process, long processing time and high cost

Method used

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  • Microsensor and its preparation method

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Embodiment 1

[0060] see figure 1 , the present invention provides a preparation method of a micro sensor, the preparation method of the micro sensor comprises the following steps:

[0061] 1) providing a substrate, and forming a limiting groove on the upper surface of the substrate, and the limiting groove defines the position and shape of the subsequently formed heat dissipation structure layer;

[0062] 2) forming an insulating material layer on the upper surface of the substrate and in the limiting groove, and the insulating material layer filled in the limiting groove constitutes a limiting ring;

[0063]3) forming test electrodes, heating elements and pads on the upper surface of the insulating material layer;

[0064] 4) etching the insulating material layer to define the shape and position of the main support layer and the support beam;

[0065] 5) etching the substrate to form release trenches in the substrate;

[0066] 6) Etching the substrate based on the release trenches to f...

Embodiment 2

[0094] please continue Figure 7 and Figure 8 , the present invention also provides a microsensor, which includes: a substrate 10, a groove 102 is formed on the upper surface of the substrate 10; a heat uniform structure layer 18, and the heat uniform structure 18 is suspended Above the groove 102, and the heat spreading structure 18 has a distance from the bottom of the groove 102 and the sidewall of the groove 102; a support beam 16, the support beam 16 is located in the groove Above the groove 102, and the support beam 16 is located between the heat evenly dissipating structure layer 18 and the sidewall of the groove 102; one end of the support beam 16 is connected to the heat evenly distributing structure layer 18, The other end is connected to the substrate 10; the main body support layer 17, the main body support layer 17 is at least located on the upper surface of the heat spreading structure layer 18; the limit ring 111, the limit ring 111 is located on the main body...

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Abstract

The present invention provides a microsensor and a preparation method thereof. The microsensor comprises: a substrate, a groove is formed on the upper surface of the substrate; a heat-dissipating structure layer is suspended above the groove; Above, and located between the heat evenly dissipating structure layer and the side wall of the groove; one end of the support beam is connected to the heat evenly dissipating structure layer, and the other end is connected to the substrate; the main support layer is at least located on the heat evenly dissipating structure layer The upper surface; the limiting ring is located on the lower surface of the main body support layer and is located at the periphery of the heat evenly spreading structure layer; the test electrode is located on the upper surface of the main body support layer; the heating element is located on the upper surface of the main body support layer; the welding pad is located on the on the upper surface of the substrate and outside the groove. In the micro-sensor of the present invention, a heat-dissipating structure is arranged under the heating element, which enhances the heat dissipation capacity of the heating area, so that the temperature uniformity of the heating area is good; the heating element and the test electrode are insulated and isolated, which can avoid leakage and ensure the micro-sensor. performance.

Description

technical field [0001] The invention belongs to the technical field of semiconductor structures, and in particular relates to a micro sensor and a preparation method thereof. Background technique [0002] With the continuous development of micromachining technology, MEMS devices with different functions have been widely used in various fields, among which microheaters have been widely used in gas sensors, microcalorimeters, gas flowmeters, infrared light sources, etc. . Among them, gas sensors based on MEMS micro-heaters have the distinct advantages of small size, low power consumption, mass production, and low price, and are especially suitable for gas sensing applications in smart terminals, wearable products, Internet of Things and other fields. to the hotspot of product development. [0003] Common MEMS gas sensors use a "sandwich" structure in which the main support layer, heating elements, insulating layers and test electrodes are superimposed to form a "direct heati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81B2201/02B81C1/00468
Inventor 陈滢李昕欣
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI