Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-dimensional face recognition method based on plane parameterization

A technology of 3D face and recognition method, which is applied in the field of 3D face recognition, can solve the problems of high computing cost of 3D data, difficulty of 3D face model, etc., and achieve an adaptable effect

Pending Publication Date: 2019-07-23
视缘(上海)智能科技有限公司
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although 3D face data has more recognition cues than 2D images, the processing of 3D data generally requires higher computational cost
On the other hand, although there are many analysis methods for 2D images, it is very difficult to directly process 3D face models due to spatial irregularities.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional face recognition method based on plane parameterization
  • Three-dimensional face recognition method based on plane parameterization
  • Three-dimensional face recognition method based on plane parameterization

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] Below in conjunction with accompanying drawing and embodiment the present invention will be further described:

[0063] Such as figure 1 As shown, a kind of three-dimensional face recognition method based on plane parameterization provided by the present invention, the main steps of the recognition method are as follows:

[0064] S1 extract ROI

[0065] S1.1 Find the symmetry plane of the facial contour

[0066] S1.1.1 First propose an efficient method to find the symmetry plane of the face surface, apply and improve it from the face model to detect the central contour curve. The specific steps are as follows:

[0067] 1) Given a point set S of face range data, we can obtain its mirror image S′ that obeys an initial approximate symmetric plane M. After S is registered as S′, S′ is translated into S″, so S and S″ form a new set of points

[0068]

[0069] Wherein S is self-symmetric, and the symmetry plane A passes through the bisector of each pair of correspondi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a three-dimensional face recognition method based on plane parameterization. The method comprises the following specific steps: firstly, automatically selecting an area containing most significant features of a human face; and then finding a base plane through the nose tip, and calculating a relative depth, namely slope denaturation; then, trangularizing and mapping the ROIin the range data into an isomorphic two-dimensional plane circle, reserving inherent geometric properties, and mapping the relative depth, and finally, applying the feature surface method to the mapping depth image to realize a recognition task. According to the method, the situation that a traditional face recognition method is very sensitive to changes of postures, illumination and expressionsis overcome, meanwhile, due to the fact that three-dimensional geometrical information is stored, more clues expressing the changes are processed, and a face model is rapidly and accurately established.

Description

technical field [0001] The invention relates to a three-dimensional face recognition method, in particular to a three-dimensional face recognition method based on plane parameterization. Background technique [0002] In recent years, automatic face recognition technology based on two-dimensional images has been extensively studied, and various techniques have been proposed. However, traditional face recognition methods are sensitive to changes in pose, illumination, and expression. The limitations of these methods originate from the limited face information in planar images. In nature, a 2D image is the projection of a 3D human face on a certain plane, and this inherent weakness of planar images makes it difficult to process. The human face is a non-rigid object formed due to the deformation of facial expressions. Although 3D face data has more recognition cues than 2D images, the processing of 3D data generally requires higher computational cost. On the other hand, alth...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06K9/32G06K9/36
CPCG06V40/165G06V40/171G06V10/25G06V10/20G06V10/247
Inventor 骞志彦王国强张斌陈学伟
Owner 视缘(上海)智能科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com