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Sheet-like body transfer device and method and silicon wafer film thickness measuring system using the same

A transfer device and measurement system technology, applied in the direction of measurement device, transportation and packaging, semiconductor/solid-state device manufacturing, etc., can solve the problems of low transfer efficiency, complex structure, and inability to complete the centering of silicon wafers, etc., to achieve high transfer efficiency, The effect of simple structure

Inactive Publication Date: 2019-07-26
YINGUAN SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This invention can complete the transfer of silicon wafers, but cannot complete the centering of silicon wafers, and the structure is more complicated
[0006] This field urgently needs to solve the relatively prominent problems of complex structure and low transfer efficiency in silicon wafer transfer devices in the prior art

Method used

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  • Sheet-like body transfer device and method and silicon wafer film thickness measuring system using the same
  • Sheet-like body transfer device and method and silicon wafer film thickness measuring system using the same
  • Sheet-like body transfer device and method and silicon wafer film thickness measuring system using the same

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Embodiment Construction

[0056] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but only to illustrate the essence of the technical solutions of the present invention.

[0057] In the following description, for the purposes of explaining the various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that an embodiment may be practiced without one or more of these specific details. In other instances, well-known devices, structures and techniques associated with the present application may not have been shown or described in detail in order to avoid unnecessarily...

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Abstract

The invention relates to a sheet-like body transfer device and method, and a silicon wafer film thickness measuring system using the same. Specifically, the sheet-like body transfer device provided bythe invention comprises an upper hand, a lower hand, a driving device and a transfer support, wherein the upper hand and the lower hand are directly or indirectly fixedly coupled to an output shaft of the driving device, the upper hand is located below the lower hand, a channel is formed between the upper hand and the lower hand, and the driving device is fixed to the transfer support. The sheet-like body transfer device provided by the invention has high transfer efficiency, simple structure, and a centering function of a silicon wafer.

Description

technical field [0001] The invention belongs to the field of integrated circuit equipment manufacturing, and more specifically relates to a device and method for transferring sheet-shaped objects and a silicon wafer film thickness measuring system using the device. Background technique [0002] In the field of film thickness detection of semiconductor silicon wafers, it is required that the workpiece table can complete the transfer of silicon wafers with the silicon wafer transmission system. With the continuous improvement of production rate requirements, the speed requirement of silicon wafer handover is getting higher and higher, and the efficiency of handover is improved accordingly. This requires the silicon wafer handover device to have high handover efficiency. [0003] In US Pat. No. 6,485,253 B1, a silicon wafer transfer solution in this field is proposed. The invention drives the four loading hands to move up and down through the cylinder, and two sets of linear ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/68H01L21/687G01B21/08
CPCH01L21/67745H01L21/67742H01L21/68H01L21/68707G01B21/08
Inventor 不公告发明人
Owner YINGUAN SEMICON TECH CO LTD
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