Method and device for grabbing electronic components

An electronic component and image acquisition technology, which is applied in the field of image recognition, can solve problems such as grasping failure and broken electronic components

Active Publication Date: 2021-08-31
MEGVII BEIJINGTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the manipulator grabs according to such an edge, it will naturally fail to grab, and even damage the electronic components.

Method used

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  • Method and device for grabbing electronic components
  • Method and device for grabbing electronic components
  • Method and device for grabbing electronic components

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Experimental program
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Embodiment Construction

[0028] The principles and spirit of the present invention will now be described with reference to several exemplary embodiments. It should be understood that these embodiments are only given for those skilled in the art to better understand and implement the present invention, but not to limit the scope of the present invention in any way.

[0029] It should be noted that although expressions such as "first", "second" and the like are used herein to describe different modules, steps, data, etc. of the embodiments of the present invention, the expressions such as "first", "second" and the like are only used in the context of A distinction is made between different modules, steps, data, etc., and does not imply a particular order or degree of importance. In fact, the expressions "first", "second" etc. are used completely interchangeably.

[0030] In order to improve the reliability of gripping electronic components, image 3 A method 100 for grabbing an electronic component pr...

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PUM

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Abstract

The present disclosure provides a method and device for grabbing an electronic component. The electronic component includes gold fingers and is stacked in two or more layers. The method for grabbing a camera includes: acquiring an image, acquiring the The image of the electronic component; the initial outline recognition step, based on the image, recognize the outline of the electronic component and the gold finger image; the edge correction step, correct the outline according to the abnormal area image of the gold finger image, and obtain the corrected outline; the grabbing step, based on the correction Outline, grabbing the frontmost electronic components. The method and device for capturing electronic components provided by the present disclosure correct the identified outline by identifying the gold finger image, thereby obtaining a more accurate outline of the electronic component, making the grasping more reliable, thereby improving the accuracy of grasping and avoiding damage The condition of the electronic components.

Description

technical field [0001] The present invention generally relates to the field of image recognition, and particularly relates to a method and device for grabbing electronic components. Background technique [0002] In the modern industrial manufacturing process, automated assembly line production is the guarantee of high efficiency. With the continuous advancement of technology, there are more and more manufacturing processes for electronic components. Some electronic components carried in the tray need to be transported. For example In the camera automatic production line, the camera in the tray is transferred to another place, for example, from the tray to the image acquisition area for six-sided shooting. [0003] One way is to grasp the electronic components by a mechanical arm. The principle of grasping is: there is an electronic component in the tray area that will capture the image in the tray, locate the edge of the electronic component to be grasped, and then place the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B25J9/16B25J13/08
CPCB25J9/161B25J9/1612B25J9/1697B25J13/08
Inventor 刘少林
Owner MEGVII BEIJINGTECH CO LTD
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