an etching device

An etching equipment and spray etching technology, applied in the field of substrate etching, can solve the problems of low panel yield and small taper angle, and achieve the effect of improving yield

Active Publication Date: 2021-03-23
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide an etching equipment to solve the technical problems of the existing etching equipment in the prior art, such as the taper angle is too small and the yield rate of the panel is too low

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Embodiment Construction

[0029] The preferred embodiments of the present invention are introduced below with reference to the accompanying drawings, in order to prove that the present invention can be implemented, and these embodiments can completely introduce the technical content of the present invention to those skilled in the art, so that the technical content of the present invention is more clear and easy to understand. However, the present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned herein.

[0030] Such as Figure 4~6 As shown, this embodiment provides an etching device, including a stage (not shown in the figure), a roller shaft 1 , a substrate 2 , a shower unit 3 , a metal layer 4 and a mask layer 5 .

[0031] In the production process of TFT-LCD panel, in order to carry out chemical liquid etching treatment to substrate 2, described stage in etching equipment is used for plac...

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Abstract

The invention provides etching equipment. The etching equipment comprises an object carrying table and more than two spraying units; the object carrying table is used for placing substrates; the spraying units are arranged above the object carrying table, and are used for spraying etching liquid to the substrates; each spraying unit comprises a first nozzle and a second nozzle; the first nozzles are towards the substrates; first included angles are formed between central axes of the first nozzles and the vertical direction; the second nozzles are towards the substrates; and second included angles are formed between central axes of the second nozzles and the vertical direction. Through the direction adjustment of each nozzle in the spraying units, the corrosion degree of the lower parts ofthe side walls of metal layers is higher, so that the angles of taper angles in panel finished products are adjusted to be not smaller, and the yield of panels is improved.

Description

technical field [0001] The invention relates to the technical field of substrate etching, in particular to an etching device. Background technique [0002] Thin Film Transistor Liquid Crystal Display (TFT-LCD) is a common liquid crystal display product at present, and wet etching process is an extremely important link in its production process. [0003] Wet etching is to use mixed acid to laterally etch the metal layer not covered by the mask layer on the glass surface. Since the etching equipment uses wet etching to etch the substrate, when the substrate is etched in the etching equipment, After the etchant is sprayed on the substrate, it flows down from the through holes and edges of the mask layer to contact and corrode the metal layer. During the etching process, etchant remains in the through hole of the mask layer, the metal layer corresponding to the through hole of the mask layer is corroded, and the sidewall of the metal layer at the edge of the through hole is cor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/08C23F1/02
CPCC23F1/02C23F1/08
Inventor 刘三泓
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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