Check patentability & draft patents in minutes with Patsnap Eureka AI!

A module that can replace the can chip

A module and chip technology, applied in the field of CAN chips, can solve the problems of high chip unit price and long procurement cycle, and achieve the effect of reducing costs

Active Publication Date: 2022-02-18
深圳市宇明电子有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All domestic CAN bus devices need to use the CAN chips produced by these large foreign companies mentioned above. Since the chips are concentrated in the hands of large foreign companies, the use of these chips will bring the following problems: 1. The unit price of the chip is high; 2. Due to All domestic purchases need to be imported, and the procurement cycle is long

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A module that can replace the can chip
  • A module that can replace the can chip
  • A module that can replace the can chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0018] Such as Figure 1-3 As shown, a module that can replace the CAN chip includes a module, and the module is provided with a first pin (CANTX), a second pin (GND), a third pin (VCC3V3), and a fourth pin (CANRX), the fifth pin, the sixth pin (CANL), the seventh pin (CANH), the eighth pin, the first switch (U1), the second switch (U2) and the transistor (Q1) , the first switch (U1) and the second switch (U2) are equipped with the first pin (A1), the second pin (GND), the third pin (A0), the fourth pin (A), the fifth pin The pin (VCC) is connected to the sixth pin (CS), the first pin (CANTX) is respectively connected to the sixth pin (CS) of the No. 1 switch (U1) and the No. 2 switch (U2), and the No. 1 switch The fourth pin (A) in (U1) is conn...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a module that can replace the CAN chip. The module is provided with a first pin (CANTX), a second pin (GND), a third pin (VCC3V3), a fourth pin ( CANRX), the fifth pin, the sixth pin (CANL), the seventh pin (CANH), the eighth pin, the first switch (U1), the second switch (U2) and the transistor (Q1). A module that can replace the CAN chip described in the present invention is provided with a No. 1 switch (U1), a No. 2 switch (U2) and a triode (Q1), which can reduce the dependence on foreign chips, break monopoly, and reduce The cost of CAN equipment, module size and pin definition are fully compatible with the original chip CAN chip, which can be directly replaced without changing the circuit board, and all the materials used in this module are general-purpose materials produced in China. The short procurement cycle brings better prospects for use.

Description

technical field [0001] The invention relates to the field of CAN chip technology, in particular to a module that can replace the CAN chip. Background technique [0002] CAN bus is the most commonly used bus protocol in automobiles, and CAN bus occupies more than 80% of the market in all automobile buses. All devices conforming to the CAN bus must use a CAN transceiver. At present, the CAN bus transceivers on the market only have dedicated chips (hereinafter referred to as: CAN chips), and the main technology is in the hands of a few large foreign companies, such as TJA1050 and TJA1050 produced by NXP, and MC33901 produced by Freescale. , MC34901, TI's SN65HVD251 and so on. All domestic CAN bus devices need to use the CAN chips produced by these large foreign companies mentioned above. Since the chips are concentrated in the hands of large foreign companies, the use of these chips will bring the following problems: 1. The unit price of the chip is high; 2. Due to All domes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/40G06F13/42
CPCG05B19/0423G05B2219/25257
Inventor 黄家武
Owner 深圳市宇明电子有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More