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Electronic component

A technology for electronic components and capacitors, which is applied to electrical components, circuits, components of fixed capacitors, etc., and can solve problems such as inability to ensure fixed strength, high acoustic noise reduction effect, and poor installation.

Active Publication Date: 2019-08-09
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the case of electronic components using usual intermediary parts, the acoustic noise reduction effect may not be as high as expected, or the fixing strength may not be secured during board mounting, resulting in poor mounting

Method used

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Embodiment Construction

[0030] Hereinafter, embodiments in the present disclosure will be described with reference to the accompanying drawings as follows. In the drawings, the shapes, sizes, etc. of components may be exaggerated or stylized for clarity.

[0031] However, this disclosure may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0032] The term "exemplary embodiment" used herein does not refer to the same exemplary embodiment, but is provided to emphasize a specific feature or characteristic that is different from that of another exemplary embodiment. However, the exemplary embodiments provided herein are considered to be able to be realized by combining whole or part with each other. For example, an element described in a particular exemplary e...

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Abstract

An electronic components includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, an interposer including an interposer body and a pair of external terminals, andan adhesive; wherein the external terminal includes a bonding portion, a mounting portion, and a connection portion; wherein an adhesive is provided between the external electrode and the bonding portion, and falls along the connection portion of the external terminal; wherein 1.55<=(L+T22) / T1 in which T2 is a height at which the adhesive falls along the connection portion of each of the externalterminals, L is a length of the bonding portion, and T1 is a height of the electronic component.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2018-0106553 filed with the Korean Intellectual Property Office on September 6, 2018, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to an electronic component. Background technique [0003] Multilayer capacitors have been used as components of various electronic devices due to their advantages such as compactness and high capacitance. [0004] Such a multilayer capacitor has a structure in which a plurality of dielectric layers and internal electrodes having different polarities are alternately arranged with the internal electrodes interposed between the dielectric layers. [0005] In this case, the dielectric layer has piezoelectric properties. Therefore, when a direct current (DC) voltage or an alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric pheno...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/30H01G4/232H01G4/002H01G4/005H01G4/12
CPCH01G4/30H01G4/232H01G4/2325H01G4/002H01G4/012H01G4/1227H01G4/1245H05K2201/049H05K1/141H05K3/3442H05K2201/2045H05K3/403H01G2/06H01G2/065H01G4/252H01G4/248H05K1/181H05K2201/10015H05K2201/10378H05K1/112
Inventor 金虎润朴祥秀申旴澈
Owner SAMSUNG ELECTRO MECHANICS CO LTD