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Circuit packaging method and packaging structure

A technology of circuit packaging and packaging body, which is applied in the direction of circuits, electrical components, electric solid devices, etc., can solve the problems that the limiter cannot take into account miniaturization, airtight packaging and strong protection performance, so as to improve the protection effect and facilitate The effect of installation and volume reduction

Active Publication Date: 2019-08-09
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a circuit packaging method and packaging structure to solve the technical problem in the prior art that miniaturization, airtight packaging and strong protection performance cannot be taken into account after the limiter is packaged

Method used

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  • Circuit packaging method and packaging structure
  • Circuit packaging method and packaging structure
  • Circuit packaging method and packaging structure

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specific Embodiment approach

[0052] see figure 2 , as a specific embodiment of the circuit packaging method provided by the present invention, the steps of loading and fixing the first package body 10 into the second package body 20 and sealing the second package body 20 also include:

[0053] External threads 11 are provided on the outside of the first package body 10, and thermal conductive agent is applied on the internal threads 21 provided inside the second package body 20 to cooperate with the external threads, so that the first package body 10 and the second package body Effective and stable heat transfer between bodies 20 can be carried out through the threaded structure;

[0054] Screw the first package body 10 into the second package body 20 through the thread structure, so that the heat conducting agent is filled in the thread structure;

[0055] A heat conduction filler is filled between the first package body 10 and the second package body 20 to enhance heat conduction in other parts.

[0...

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Abstract

The invention provides a circuit packaging method and packaging structure and belongs to the technical field of circuit packaging. The method comprises steps that a function circuit is connected withan input interface and an output interface; the function circuit is placed in a first packaging body; after stable gas is filled, the first packaging body is sealed; the first packaging body is packaged and is fixed at a second packaging body, the second packaging body is sealed, and an outer end of the input interface and an outer end of the output interface are exposed through the second packaging body. The circuit packaging structure includes the first packaging body, the second packaging body, the input interface and the output interface. The circuit packaging method and structure are advantaged in that the omnibearing protection effect of the function circuit can be improved, a two-layer packaging mode and a coaxial packaging mode achieve the protective effect through the relatively high strength outer structure, an inner layer acts as the hermetic packaging effect, and thereby the volume after packaging is reduced, and mounting is easy.

Description

technical field [0001] The invention belongs to the technical field of circuit packaging, and more specifically relates to a circuit packaging method and a packaging structure. Background technique [0002] High-power microwave (HPM) refers to a coherent electromagnetic radiation source with an instantaneous peak power exceeding 100MW and a radiation wavelength in the range of centimeters to millimeters, that is, a frequency between 0.3GHz and 300GHz. With the rapid development of high-power microwave weapons and the maturity of electronic countermeasure technology, the electromagnetic environment faced by today's electronic equipment is more complex, and the threat it receives is even greater. Due to its high power and high frequency, high-power microwaves have great interference and harm to electronic equipment, and the protection requirements for high-power microwave weapons are becoming more and more urgent. In order to obtain a better heat dissipation effect, the tradi...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31
CPCH01L21/56H01L23/31
Inventor 邓世雄陈书宾孔令甲任玉兴周彪王磊袁彪汤晓东
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP