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Manufacturing method of heat conduction packaging structure and wearable device

A technology of packaging structure and manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve the problems of increasing packaging cost and increasing the difficulty of sensor design, and achieve the effect of reducing interference

Inactive Publication Date: 2019-08-16
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among various requirements, thermal management is one of the important contents of sensor packaging. In the existing technology, there are generally three packaging forms for the heat conduction requirements of sensors. One is to use PCB boards to conduct heat. Such conduction The method will increase the difficulty of the overall design of the sensor; one is the use of plug-in packaging, which will cause more inconvenience in use, and the other is the use of metal packaging, which requires the use of substrates and metal packaging shells. Greatly increase packaging cost

Method used

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  • Manufacturing method of heat conduction packaging structure and wearable device
  • Manufacturing method of heat conduction packaging structure and wearable device
  • Manufacturing method of heat conduction packaging structure and wearable device

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Embodiment Construction

[0030] In order to further explain the technical means and functions adopted by the present invention to achieve the intended invention purpose, the detailed description is as follows in conjunction with the accompanying drawings and preferred embodiments.

[0031] The invention provides a method for manufacturing a heat-conducting packaging structure and a wearable device with the heat-conducting packaging structure. The heat-conducting packaging structure can have better heat-conducting performance.

[0032] figure 1 A schematic cross-sectional structure diagram of the thermally conductive packaging structure provided by the first embodiment of the present invention, as shown in figure 1 As shown, in the first embodiment of the present invention, the thermally conductive packaging structure includes a thermally conductive plate 10, a chip 20, a device pin structure 30, and an encapsulation layer 40, the chip 20 is arranged on the thermally conductive plate 10, and the encaps...

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Abstract

The invention provides a manufacturing method of a heat conduction packaging structure. The method comprises the following steps of: providing a heat conduction plate and a chip; fixing the chip at one side of the heat conduction plate; manufacturing a device pin structure, wherein the pad of the chip is connected with the device pin structure; and packaging the chip and the device pin structure through a packaging layer, wherein the chip, the device pin structure and the packaging layer are located at the same side of the heat conduction plate. The packaging structure manufactured by employing the manufacturing method of the heat conduction packaging structure has the good heat conduction performance.

Description

[0001] This application is a divisional application for an invention patent with an application date of February 8, 2018, an application number of 201810126868.4, and a patent titled "Heat-conducting packaging structure, manufacturing method, and wearable device with the same". technical field [0002] The invention relates to the technical field of chip packaging, in particular to a method for manufacturing a heat-conducting packaging structure and a wearable device. Background technique [0003] In recent years, with the development of technology, the application of sensors has become more and more extensive, and different working environments have put forward new requirements for the packaging form and performance of sensors. [0004] Among various requirements, thermal management is one of the important contents of sensor packaging. In the existing technology, there are generally three packaging forms for the heat conduction requirements of sensors. One is to use PCB boar...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56H01L23/31H01L23/367H01L23/48
CPCH01L21/50H01L21/56H01L23/31H01L23/3672H01L23/481H01L2224/48091H01L2924/181H01L2924/00014H01L2924/00012
Inventor 龚云平汪洋刘洪
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG