Display panel and display device
A technology for display panels and display areas, applied in semiconductor devices, electrical components, circuits, etc., can solve problems that affect and affect the reliability of display panel packaging, and achieve the goal of reducing width, ensuring adhesion, and improving packaging reliability. Effect
Active Publication Date: 2021-12-24
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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- Abstract
- Description
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- Application Information
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Problems solved by technology
The bonding between the cover plate and the array substrate is achieved through Frit sintering and curing. Therefore, the sintering effect of Frit affects the adhesion between Frit and the array substrate, which in turn affects the packaging reliability of the display panel.
Method used
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Embodiment Construction
[0027] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.
[0028] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...
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The invention discloses a display panel and a display device. The display panel includes an array substrate, a cover plate opposite to the array substrate, and an encapsulation adhesive layer for encapsulating the array substrate and the cover plate. The array substrate has a display area and an encapsulation area located on the outer peripheral side of the display area. The array substrate includes a The inorganic layer and the signal line layer, the inorganic layer and the signal line layer are at least partially located in the packaging area, and in the packaging area, the signal line layer is at least partially embedded in the inorganic layer, and the side of the signal line layer facing away from the substrate does not protrude from the inorganic layer away from the substrate On the bottom side, the bonding surface between the encapsulation adhesive layer and the array substrate is flat, and the projection of the encapsulation adhesive layer in the thickness direction of the array substrate overlaps the inorganic layer and the signal line layer. In the display panel disclosed by the present invention, the bonding surface between the packaging adhesive layer and the array substrate is flat, which can ensure the adhesion of the contact surface between the packaging adhesive layer and the array substrate, and improve the packaging reliability of the display panel.
Description
technical field [0001] The invention belongs to the field of display technology, in particular to a display panel and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) display has the advantages of low cost, wide viewing angle, low driving voltage, fast response speed, rich luminous color, simple preparation process, and large-area flexible display. It is considered to have the most development prospects. One of the display technologies. [0003] Since the organic luminescent material of the OLED display panel is susceptible to the intrusion of water and oxygen to affect the display effect, the packaging requirements are relatively high, and in order to achieve a narrow frame, signal lines are usually provided in the packaging area of the display panel. In the related art, glass glue (Frit) is often used to package the array substrate and the cover plate of the OLED display panel. The bonding between the cover plate and the array substra...
Claims
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IPC IPC(8): H01L27/32H01L51/52
CPCH10K59/10H10K50/84
Inventor 谢正芳许传志刘权
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD