Semiconductor material production technology equipment

Abstract

The invention discloses semiconductor material production technology equipment. The equipment structurally comprises a chip collecting device, a machining table and a shell, wherein the chip collecting device is mechanically connected with the machining table; the machining table is arranged in the center of the shell and penetrates through the shell; and the shell is connected with the chip collecting device. The semiconductor material production technology equipment has the beneficial effects that external mechanical force is used to drive a center shaft to rotate clockwise, and a chip feeding mechanism is driven to rotate by a rotating rod, so that waste chip generated by a polishing machine enters into the chip feeding mechanism and reach an annular channel so as to achieve the purposeof collecting the waste chip; and through the different height reached by the chip feeding mechanism rotating with an annular wall plate, the size of openings between a movable plate and a fixing plate after rotating around a fixing shaft is different, and a rectangular slide block slides downward under the action of gravity to squeeze the air into a first cavity to push a rotating shifting pieceto rotate so as to assist in shifting waste chips into a chip collecting cavity to achieve the purpose of avoiding the damage of parts inside the polishing machine caused by the waste chip entering into the polishing machine.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a technical equipment for producing semiconductor materials. Background technique [0002] After the semiconductor production is completed, due to the local unevenness on the surface, the semiconductor needs to be further polished. , when the residual material is separated from the semiconductor, it will splash outward under the action of centripetal force. Therefore, it is necessary to design a semiconductor production equipment that prevents the residual material from splashing. The current semiconductor material production technology equipment has the following defects: [0003] The traditional solution is to set up a cover on the outside of the polishing machine to cover the polishing machine, but this way is easy to cause the residual material to splash and fall and deposit between the inner edge of the cover and the polishing machine due to the blocking of the cover, and the r...

AI Technical Summary

Problems solved by technology

[0002] After the semiconductor production is completed, due to the local unevenness on the surface, the semiconductor needs to be further polished. , when the residual material is separated from the semiconductor, it will splash outward under the action of centripetal force. Therefore, it is necessary to design a semiconductor production equipment that prevents the residual material from splashing. The current semiconductor material production technology equipment has the following defects:

[0003] The traditional solution is to set up a

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