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EPS special-shape package mold without vapor lock

A special-shaped and steam-plug technology, applied in the field of steam-plug-free EPS special-shaped packaging molds, can solve the problems of unevenness, smoothness that cannot meet customer requirements, and high water content in products

Pending Publication Date: 2019-08-23
江西维力科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, whether it is an automatic machine or a semi-automatic machine, the product cavity and the heating cavity are connected through a steam plug, which will cause: heating steam and cooling water are directly loaded on the EPS product, and the produced product contains The amount of water is extremely high, there are many steam plug holes on the surface of the product, it is not smooth, and the finish does not meet the customer's requirements

Method used

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  • EPS special-shape package mold without vapor lock
  • EPS special-shape package mold without vapor lock
  • EPS special-shape package mold without vapor lock

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The present invention provides such as Figure 1-4 A steam plug-free EPS special-shaped packaging mold shown includes an upper mold 1 and a lower mold 2, a hydraulic rod 3 is provided between the upper mold 1 and the lower mold 2, and a material gun 4 is provided on the top of the upper mold 1. The surface of the material gun 4 is provided with a water outlet 5, both sides of the material gun 4 are provided with a steam interface 6, the side of the material gun 4 is provided with a vent 7, and the inside of the material gun 4 is provided with a water passage 8, The inside of the water channel 8 is provided with an air channel 9, the inside of the upper mold 1 is provided with a grid 10, the bottom surface of the upper mold 1 is provided with a frame 11, and the inside of the frame 11 is provided with a ventilation groove 12, so The inner wall of the card frame 11 is provided with an air outlet 13, and one side of the card frame 11 is provided with an air outlet pipe 14;...

Embodiment 2

[0030] The card frame 11 is fixedly connected with the upper mold 1, the number of the water outlets 5 is set to four, the water outlets 5 are communicated with the water passage 8, and the air outlet 7 is communicated with the air passage 9, so as to avoid passing through the air outlet. The incoming air contacts the moisture inside the water channel 8 .

[0031] The bottom surface of the water passage 8 is provided with holes, and the holes communicate with the inside of the upper mold 1. When the high-temperature steam touches the grid 10, the steam quickly dissipates heat and liquefies into water droplets that condense on the surface of the grid 10, and then Enter the inside of the water channel 8 through the holes on the surface of the water channel 8 , and then discharge the water and steam through the water outlet 5 on the surface of the water channel 8 , and the steam interface 6 communicates with the inside of the upper mold 1 .

[0032] The air outlet pipe 14 and the...

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Abstract

The invention discloses an EPS special-shape package mold without a vapor lock. The EPS special-shape package mold without the vapor lock comprises an upper mold and a lower mold. A hydraulic rod is arranged between the upper mold and the lower mold. A material gun is arranged on the top of the upper mold. A water outlet is arranged on the surface of the material gun. Vapor connectors are arrangedon both the two sides of the material gun. An air port is arranged on the side face of the material gun. A water channel is formed inside the material gun. According to the EPS special-shape packagemold without the vapor lock, because the upper mold is arranged, it can be avoided that water appears on the surface, when the upper mold is heated, high-temperature vapor is fed into the upper mold through the vapor connectors, and after the vapor enters the upper mold, the heat of vapor disperses quickly on the surface of a grid by utilizing the all-directional dispersing effect of the grid, andthe surface temperature of the upper mold and the surface temperature of a clamping frame quickly rise; and when high-temperature vapor makes contact with the grid, the vapor quickly loses heat to beliquified into water drops on the surface of the grid in a condensed manner, then the vapor and the water drops enter the water channel through a hole groove in the surface of the water channel, water is drained through a water outlet in the surface of the water channel, and vapor is exhausted through the water outlet in the surface of the water channel as well.

Description

technical field [0001] The invention relates to the technical field of molds, in particular to a steam plug-free EPS special-shaped packaging mold. Background technique [0002] At present, whether it is an automatic machine or a semi-automatic machine, the product cavity and the heating cavity are connected through a steam plug, which will cause: heating steam and cooling water are directly loaded on the EPS product, and the produced product contains The amount of water is extremely high, and there are many steam plug holes on the surface of the product, which is not smooth, and the finish does not meet the customer's requirements. [0003] Therefore, it is necessary to invent a kind of non-vapor plug EPS special-shaped packaging mold to solve the above problems. Contents of the invention [0004] The purpose of the present invention is to provide a non-steam plug EPS special-shaped packaging mold. The steam quickly dissipates heat and liquefies into water droplets that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C33/04B29C33/10B29K25/00
CPCB29C33/048B29C33/10B29K2025/06
Inventor 陈申荣桂小宾毛连荣
Owner 江西维力科技有限公司
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