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probe assembly

A technology of probes and components, applied in the field of probe components and their probe structures, can solve the problems of increased difficulty in probe arrangement, achieve the effects of improving signal integrity, reducing maintenance costs, and shortening transmission paths

Active Publication Date: 2021-06-11
CHUNGHWA PRECISION TEST TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the number of pins is large or the spacing is small, it will lead to increased difficulty in probe arrangement

Method used

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Experimental program
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Effect test

no. 1 example

[0035] First, see Figure 1 to Figure 4 shown, and see also Figure 11 as shown, figure 1 and figure 2 are respectively the three-dimensional schematic diagrams of the probe structure of the first embodiment of the present invention, image 3 It is a schematic side view of the probe structure of the first embodiment of the present invention, Figure 4 It is a schematic top view of the probe structure of the first embodiment of the present invention, Figure 11 It is a schematic side view of the probe assembly according to the second embodiment of the present invention. The present invention provides a probe assembly M and a probe structure 1 thereof. The first embodiment will first introduce the main technical features of the probe structure 1 of the present invention, and the second embodiment will introduce the probe assembly M.

[0036] With the above, please continue to read Figure 1 to Figure 4 As shown, the probe structure 1 includes a first contact section 11 , ...

no. 2 example

[0044] First, see Figure 9 to Figure 11 as shown, Figure 9 to Figure 11 They are schematic side views of the assembly process of the probe assembly M according to the second embodiment of the present invention. It should be noted that, in order to facilitate the understanding of this embodiment, the drawings only show the partial structure of the probe assembly M, so as to clearly show the structure and connection relationship of the various components of the probe assembly M. The structure of each element of the probe assembly M and its connection relationship will be introduced respectively below. In other words, in order to facilitate the understanding of the drawings, Figure 9 to Figure 11 Probe structure 1 in only presents the local configuration of probe structure 1. However, the probe structure 1 provided in the second embodiment is similar to the structure in the previous embodiments, and will not be repeated here. Therefore, after referring to Figure 9 to Fig...

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PUM

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Abstract

The invention discloses a probe assembly. The probe structure includes a first contact segment, a first connection segment, a second connection segment and a second contact segment. The first contact segment has an abutting portion and a first end connected to the abutting portion. The first connection section is connected to the first contact section. The second connection section is connected to the first connection section. The second contact segment is connected to the second connection segment, and the second contact segment has a second end. Thereby, since the probe structure can be replaced separately to form a replaceable probe structure, the present invention can reduce the maintenance cost.

Description

technical field [0001] The invention relates to a probe assembly and its probe structure, in particular to a probe assembly and its probe structure applied to a wafer probe card. Background technique [0002] First of all, in the prior art cantilever probe card, the probes are soldered on the printed circuit board one by one manually, and at the same time, the probes are fixed by an adhesive (such as epoxy resin). For example, in the "probe card" patent disclosed by TW I447397, the probes 33 are fixed on the circuit board 34 by using the holding part 36 containing epoxy resin. [0003] However, in the above prior art, when the epoxy resin hardens, the cantilever probe card becomes difficult to maintain. In other words, when one of the probes is damaged, the cantilever probe card in the prior art cannot replace the damaged probe alone, and the entire set of cantilever probe cards must be replaced. [0004] Furthermore, the wire bonding method of the cantilever probe card in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/073
CPCG01R1/07392
Inventor 李文聪谢开杰邓元玱
Owner CHUNGHWA PRECISION TEST TECH