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A kind of warping type thermosetting epoxy board and preparation method thereof

A thermosetting, warping technology, applied in the direction of chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of high cost, complicated process, unsatisfactory warping effect, etc. Effect

Active Publication Date: 2022-01-25
广东裕丰威禾新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a warped thermosetting epoxy board and its preparation method, aiming at solving the problem of complex process, high cost, Unsatisfactory warping effect

Method used

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  • A kind of warping type thermosetting epoxy board and preparation method thereof
  • A kind of warping type thermosetting epoxy board and preparation method thereof
  • A kind of warping type thermosetting epoxy board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Get the first prepreg (conventional FR4 prepreg produced by our company, model WH3125, specification 7628RC445), quantity 1pcs, wherein, the first prepreg includes by weight: 55.5 parts of glass cloth, 24.5 parts of epoxy resin, phenolic resin composition 10 parts, 10 parts of the first inorganic filler.

[0036] Take the second prepreg (lightweight prepreg produced by our company, model WH3127, specification 2116RC420), quantity 1pcs. Wherein, the second prepreg includes by weight: 58 parts of glass cloth, 21 parts of thermosetting resin, 0.5 part of coupling agent, 0.02 part of accelerator, 0.48 part of dispersant, and 22 parts of second inorganic filler.

[0037]Cut the first prepreg and the second prepreg into appropriate sizes, stack one first prepreg on one side, and one second prepreg on the other side, and stack them neatly to obtain a prepreg combination. Combine the pre-stacked prepregs, top and bottom Add a release film at a temperature of 170-200°C and a pr...

Embodiment 2

[0039] Take the first prepreg (conventional FR4 prepreg, model is WH3125, specification 2116RC450), quantity 2pcs, wherein, the first prepreg comprises by weight: 55 parts of glass cloth, 15 parts of epoxy resin, 20 parts of phenolic resin composition, the second 10 parts of an inorganic filler.

[0040] Take the second prepreg (lightweight prepreg, model WH3127, specification 1080RC680), quantity 1pcs. Wherein, the second prepreg includes by weight: 32 parts of glass cloth, 35 parts of thermosetting resin, 0.4 part of coupling agent, 0.2 part of accelerator, 0.4 part of dispersant, and 32 parts of second inorganic filler.

[0041] Cut the first prepreg and the second prepreg into appropriate sizes, stack two first prepregs on one side, and one second prepreg on the other side, and stack them neatly to obtain a prepreg combination. Combine the pre-stacked prepregs, top and bottom Add a release film at a temperature of 170-200°C and a pressure of 10-25kg / cm 2 Under the condit...

Embodiment 3

[0043] Take the first prepreg (conventional FR4 prepreg, model is WH3125, specification 1080RC680), quantity 2pcs, wherein, the first prepreg includes by weight: 32 parts of glass cloth, 28 parts of epoxy resin, 15 parts of phenolic resin composition, the second 1. 25 parts of inorganic filler.

[0044] Take the second prepreg (lightweight prepreg, model WH3127, specification 1080RC680), quantity 2pcs. Wherein, the second prepreg includes by weight: 32 parts of glass cloth, 32 parts of thermosetting resin, 0.3 part of coupling agent, 0.2 part of accelerator, 0.5 part of dispersant, and 35 parts of second inorganic filler.

[0045] Cut the first prepreg and the second prepreg into proper size, stack 2 first prepregs on one side, and stack 2 second prepregs on the other side, stack them neatly, add release film up and down, at a temperature of 170-200°C, Pressure 10~25kg / cm 2 Under the condition of hot pressing for 150min, 10Kgf / cm 2 The pressure is cold-pressed for 90 minute...

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Abstract

The invention discloses a warping thermosetting epoxy board and a preparation method thereof. The warping thermosetting epoxy board is obtained by stacking several first prepregs and second prepregs, hot pressing and then cold pressing , wherein the expansion rate of the first prepreg during hot pressing and the shrinkage rate during cold pressing are different from those of the second prepreg. The present invention uses two kinds of prepregs with different thermal expansion and contraction coefficients, and the warped thermosetting epoxy board obtained by hot pressing molding can realize a certain range of warping without applying external force, and is not easy to be damaged or broken. The basic characteristics of the epoxy board are still retained, and it has functions such as insulation and support.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a warped thermosetting epoxy board and a preparation method thereof. Background technique [0002] As a large category of composite materials, epoxy board has good electrical insulation and mechanical properties, as well as light and durable features, and has been more and more widely used in insulation, support, decoration and other fields. Epoxy boards usually use glass cloth, glass felt, non-woven fabrics, and paper as reinforcing materials, impregnated with thermosetting resins such as epoxy resin and phenolic resin, and baked by an impregnation machine to make a prepreg, then cut, stacked, and hot-pressed. Made by machine curing. Epoxy boards are usually made of the same system of resin formulations, and the symmetrical structure is considered when stacking. In the case of mirror steel plates as the mold, they are hot-pressed. In the forming stage, its expansio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/04B32B17/12B32B27/04B32B27/18B32B27/20B32B27/38B32B27/42B32B7/02B32B7/027B32B37/06B32B37/08B32B37/10C08L63/00C08L61/06C08K7/14C08K3/36C08K3/22C08K3/34C08K3/26C08K7/28C08K7/26C08J5/24
CPCB32B5/02B32B5/26B32B37/06B32B37/08B32B37/10B32B7/027C08J5/24B32B2260/021B32B2260/046B32B2262/101B32B2264/102B32B2264/104B32B2264/12B32B2307/30C08J2363/00C08J2461/06C08K7/14C08K3/36C08K2003/2227C08K3/34C08K2003/265C08K2003/2224C08K7/28C08K7/26
Inventor 龚岳松王运来贺艳琼
Owner 广东裕丰威禾新材料科技股份有限公司
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