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Heat dissipation shock-proof structure

A shock-resistant, extended-section technology, applied in the direction of record carrier structural parts, instruments, record information storage, etc., can solve the problems of escape, poor thermal conductivity of foam, and easy damage.

Inactive Publication Date: 2019-09-17
SHENXUN COMP KUNSHAN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the hard disk will generate a large amount of heat during operation, and these foams have the problem of poor thermal conductivity, therefore, the existing protective structure can only provide protection for the hard disk, and the heat generated by the hard disk during operation However, it cannot escape through the protective structure and is easily damaged

Method used

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Embodiment Construction

[0031] The heat dissipation and shockproof structure 1 of the present invention is used for an electronic module, wherein, please refer to figure 1 and figure 2 , is a schematic diagram showing the combination of the first embodiment of the present invention and a hard disk 21 of the electronic module (not shown in the figure). The heat-dissipating and shock-resistant structure 1 of this embodiment includes two supporting parts 11 and a plurality of elastic bodies 12 . The relationship between the components of the heat-dissipating and shock-resistant structure 1 and the electronic modules will be described in detail below.

[0032] These bearings 11 are respectively arranged on two opposite sides 213 of the hard disk 21. Since these bearings 11 and the hard disk 21 are connected in the same way, this embodiment only makes a connection relationship between one of the bearings 11 and the hard disk 21. illustrate. The carrier 11 has a fixed section 111 and two first extension...

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Abstract

The invention provides a heat dissipation shock-proof structure and is applied to an electronic module, the electronic module is provided with a hard disk. The heat dissipation shock-proof structure comprises a bearing piece and an elastic body, the bearing piece is provided with a fixed section and two first extending sections, the first extending sections are connected to the two ends of the fixed section, the fixed section can be connected to one side face of the hard disk, the distance between the first extending sections is larger than the thickness of the hard disk, and the elastic body is at least partially located on the first extending sections. According to the heat-dissipation shock-proof structure provided by the invention, the hard disk is firstly erected between the bearing pieces; the bearing piece can dissipate heat energy generated during operation of the hard disk, a first layer of protection can be provided for the hard disk, the hard disk is not likely to be extruded, then the elastic body is arranged, the elastic body can effectively adsorb external vibration energy, a second layer of protection is provided for the hard disk, and meanwhile the effects of heat dissipation and shock absorption are achieved.

Description

[0001] 【Technical field】 [0002] The invention relates to a heat dissipation and shockproof structure, especially a heat dissipation and shockproof structure for a hard disk in an electronic device. [0003] 【Background technique】 [0004] Since a hard disk in an existing electronic device usually has a structure such as a magnetic disk, a magnetic disk read head, and a plurality of drive motors in the internal structure, if the hard disk is severely shaken or damaged during the access process, Extrusion can easily affect the actuation of the aforementioned components, causing damage to the structure for accessing the magnetic disk. In order to effectively protect the hard disk, the existing protective structure usually includes several foams. After covering the entire hard disk with these foams, the protective structure and the hard disk are then fixed in the interior of an electronic device. When the When the electronic device is picked up, placed on the table, or accidenta...

Claims

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Application Information

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IPC IPC(8): G11B33/08G11B33/14
CPCG11B33/08G11B33/1426
Inventor 萧惟中
Owner SHENXUN COMP KUNSHAN
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