Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Voltage trimming method

A voltage and measurement technology, applied in the direction of measuring electricity, measuring electrical variables, and electronic circuit testing, etc., can solve the problems of long file-seeking time in the voltage trimming method, and achieve the problem of overcoming the range that does not meet the demand and avoiding the long-term file-seeking time. Effect

Active Publication Date: 2019-09-27
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a voltage trimming method to solve the problem of long search time in the existing voltage trimming method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Voltage trimming method
  • Voltage trimming method
  • Voltage trimming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The voltage adjustment method proposed by the present invention will be further described in detail below in conjunction with the drawings and specific embodiments. According to the following description and claims, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0031] The core idea of ​​the present invention is to provide a voltage trimming method to solve the problem of long search time for the existing voltage trimming method.

[0032] In order to realize the above-mentioned idea, the present invention provides a voltage adjustment method, the voltage adjustment method includes: establishing a program sub-function in the test machine; placing the wafer on the probe station and adjusting the first default gear Into the test...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a voltage trimming method. The voltage trimming method comprises the steps of: establishing a program sub-function in a testing machine; putting a wafer on a probe station, calling a first default gear into the testing machine; performing contact measurement for a group of chips on the wafer to obtain a plurality of first measurement voltages; determining whether the first measurement voltages are within a demand range or not by the testing machine; and if yes, recording a gear corresponding to the first measurement voltages by the program sub-function, writing the gear corresponding to the first measurement voltages into a chip register, calculating the gear with the highest occurrence frequency at the moment by the program sub-function, taking the gear with the highest occurrence frequency as a first default gear to be called into the testing machine, and moving the testing machine to the next group of chips to perform contact measurement on the next group of chips.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, and in particular to a voltage adjustment method. Background technique [0002] Wafer testing is abbreviated as Chip Probing, which is the first stop of semiconductor downstream packaging testing. The purpose of Chip Probing is to ensure that each chip can basically meet the characteristics of the device or the design specification (Specification), usually including voltage, current, timing and function Verification. The equipment used in Chip Probing includes a tester (IC Tester), a probe card (Probe Card), a probe station (Prober) and the interface between the tester and the probe card (MechanicalInterface). [0003] The voltage trim method is one of the basic operations of the Flash test, and is the most common in the ChipProbing test. Due to the difference in process size and process structure, the voltage adjustment items range from 2 to 8. figure 1 It is the current mainstream thr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2851
Inventor 王善屹索鑫
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com