Method and system for measuring and evaluating influence of process level errors on standing-wave ratio of microwave system
A technology of microwave system and standing wave ratio, which is applied in measuring devices, measuring electrical variables, measuring resistance/reactance/impedance, etc., which can solve problems such as increased transmission loss, increased transmission loss, and parameter frequency drift
Active Publication Date: 2019-10-08
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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Problems solved by technology
The brazing penetration rate has a great influence on the telecommunications index of microwave components. If there is a brazing gap between the microstrip board and the shell, it will lead to poor impedance matching of the microwave signal, increased transmission loss, and even signal resonance; the connector installation gap will The frequency drift of parameters, the increase of transmission loss, and the reduction of reliability, etc.; the gold wire bonding process is the key technology to realize the electrical interconnection of microwave multi-chip components. Usually, a certain arc is used to realize the connection between the chip and the substrate, and between the substrate and the substrate. The quality of interconnection and gold wire bonding process directly affects the reliability and stability of the circuit, and has a great impact on the microwave performance of the circuit
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[0043] In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:
[0044] This embodiment provides a method for measuring and evaluating the influence of process-level errors on the standing wave ratio of a microwave system, which can measure the deviation of the penetration rate, the installation deviation of the connector, the crown height and the bonding distance of the gold wire bonding, and evaluate their impact on the standing wave ratio of the microwave system. The impact of the wave ratio, the use of optical measurement methods to achieve measurement, and analyze and evaluate its impact on the standing wave ratio of the material, the specific steps are as follows:
[0045] Step 1. Construct part test sample:
[0046] Sample structure such as figure 1 , figure 2 As shown, the substrate mate...
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The invention provides a method and system for measuring and evaluating influence of process level errors on a standing-wave ratio of a microwave system, and the method comprises the following steps of S100, constructing a sample; S200, measuring the process level errors generated during the manufacturing process of the sample, including a brazing permeability beta1, a connector installation deviation beta2, a gold wire arch height deviation alpha1 and a gold wire bonding distance deviation alpha2; S300, replacing the sample and repeating the above steps to obtain the influence of four error sources of the sample on the standing-wave ratio; and S400, carrying out measurement and evaluation, firstly performing Gaussian weighting on the error sources, and normalizing the four weights to thenobtain the weight distribution of each error on the standing-wave ratio. Compared with the prior art, the invention provides a method for measuring and evaluating the influence of the brazing permeability deviation, the connector installation deviation and the gold wire bonding process on the standing-wave ratio, is quick and convenient to detect the sample and is non-invasive with no destructiveness to the sample, and applies Gaussian weighted distribution to each error source such that the influence of the errors on the standing-wave ratio of the sample is more scientific and objective.
Description
technical field [0001] The invention relates to the technical field of microwave component assembly process error evaluation, in particular to a method and system for measuring and evaluating the influence of process-level errors on the standing wave ratio of a microwave system. Background technique [0002] Micro-assembly technology has the characteristics of miniaturization, high integration, and high reliability. Microwave components using micro-assembly technology are 10 to 20 times lighter than ordinary discrete device circuits, and 4 to 6 times smaller in size. times up. High-density microwave system is a high-precision, high-performance new-concept electromechanical-magnetic complex system. There are a large number of T / R components, antennas, radome and other structural parts. During the manufacturing process, welding, gluing, etc. During the service operation, it faces various environments such as sun exposure, rain and snow, and hurricanes. Therefore, there are ma...
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IPC IPC(8): G01R27/06
CPCG01R27/06
Inventor 王梅张阳阳胡子翔吴伟王平安梁占刚张平吴文志杨静侯守武彭超
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST