Multilayer circuit board with error prevention function and manufacturing process thereof

Abstract

The invention relates to a multilayer circuit board with the error prevention function and a manufacturing process thereof. The multilayer circuit board includes multiple layers of cores arranged in sequence, wherein the two adjacent layers of cores are pressed together by a prepreg, each layer of cores is provided with error prevention proofing holes corresponding to the position, the error prevention proofing holes have rectangular structures, and rectangle lengths of the error prevention proofing holes of the multiple layers of cores sequentially decrease from the top to the bottom. The multilayer circuit board is advantaged in that each layer of cores is provided with the error prevention proofing holes, the error prevention proofing holes have the rectangular structures, the rectanglelengths of the error prevention proofing holes of the multiple layers of cores sequentially decrease from the top to the bottom, when the multilayer circuit board is stacked, whether the multiple layers of cores are stacked correctly can be rapidly determined through detecting whether the decreasing rule of the error prevention proofing holes is correct, defective circuit boards are prevented from flowing to the later process, product quality is improved, and enterprise production cost is reduced.

Description

technical field [0001] The application relates to the technical field of circuit board production, and in particular, relates to a multilayer circuit board with an error-proof function and its manufacturing process. Background technique [0002] In the production process of multi-layer circuit boards, it is necessary to pre-laminate different inner layer cores and different types of PP (Prepreg, prepreg) and then press them together. And PP is arranged and stacked, because it is difficult to distinguish between different types of board cores or PP, generally use a marker pen to draw different marks on each board core or PP to distinguish, and when manually stacking, search for the correct board core or PP mark, and then superimpose according to the mark. However, the above-mentioned marks on the board core and PP are easy to be lost or erased during storage or transportation, resulting in manual errors in the subsequent stacking of the boards, and it is difficult to correct...

AI Technical Summary

Problems solved by technology

However, the above-mentioned marks on the board core and PP are easy to be lost or erased during storage or transportation, resulting in manual errors in the subsequent stacking of the boards, and it is difficult to correct the wrong order of the stacked boards during the pressing process. Defective products are screened, so that the defective circuit boards will continue to be processed until the defective circuit boards fail in the functional test process before they can be intercepted, which greatly increases the production cost of the enterprise

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