Unlock instant, AI-driven research and patent intelligence for your innovation.
A preparation method of high melting point resin powder material for selective laser sintering
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A resin powder and laser sintering technology, which is applied in the field of additive manufacturing, can solve problems such as powder coating cracking, affecting the molding process, and sintering failure
Active Publication Date: 2022-06-07
HUNAN FARSOON HIGH TECH CO LTD
View PDF6 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
High melting point resin powder materials need to be sintered at a very high temperature. The powder fluidity of powder materials is affected by high temperature and is significantly reduced. It is prone to powder cracking during sintering, which affects the molding process, resulting in sintering failure or surface cracks on the part.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0027] (1) Mix 1000g of PET resin powder with a particle size range of 30-100μm and 20g of silicon dioxide with a particle size of 20nm after polydimethylsiloxane treatment on the surface at a stirring rate of 1400r / min to obtain a PET powder predispersion , and then the above-mentioned powder predispersion, the remaining 3000g PET powder with a particle size range of 30-100μm, 8g N, N'-bis(3,5-di-tert-butyl-4-hydroxyphenylpropionamide), 4g2, 2'-Ethylene bis(4,6-di-tert-butylphenyl) fluorophosphite was added to a mixer, mixed evenly at a speed of 300r / min, and sieved to obtain PET powder material;
[0028] (2) The above-mentioned powders were sintered on selective laser sintering equipment. The parameters of the powder materials and sintering phenomena are shown in Table 1. The performance tests of the obtained sintered strips are shown in Table 2.
Embodiment 2
[0033] (1) Mix 1000g of PEI resin powder with a particle size range of 30-100μm and 20g of silicon dioxide with a particle size of 20nm treated by hexamethyldisilazane on the surface at a stirring rate of 1400r / min to obtain a PEI powder predispersion , and then the above-mentioned powder predispersion, the remaining 3000g of PEI powder with a particle size range of 30-100μm, 40g of 2,4-dihydroxybenzophenone, 8g of 2,6-di-tert-butyl-4-methyl-phenol, 4g2 , 2'-ethylenebis(4,6-di-tert-butylphenyl) fluorophosphite was added to the mixer, mixed evenly at a speed of 300r / min, and sieved to obtain PEI powder material;
[0034] (2) The above powder was sintered on Hunan Farsoon Hi-Tech ST252 selective laser sintering equipment. The powder material parameters and sintering phenomenon are shown in Table 1. The performance test of the obtained sintered sample is shown in Table 2.
Embodiment 3
[0039] (1) Mix 1000g of PPS resin powder with a particle size range of 30-100μm and 20g of silicon dioxide with a particle size of 20nm treated by hexamethyldisilazane on the surface at a stirring rate of 1400r / min to obtain a PPS powder predispersion , and then the above-mentioned powder predispersion, the remaining 3000g PPS powder with a particle size range of 30-100μm, 40g2,4-dihydroxybenzophenone, 8g2,6-di-tert-butyl-4-methyl-phenol, 4g2 , 2'-ethylenebis(4,6-di-tert-butylphenyl) fluorophosphite was added to the mixer, mixed evenly at a speed of 300r / min, and sieved to obtain the PPS powder material;
[0040] (2) The above powder was sintered on Hunan Farsoon Hi-Tech ST252 selective laser sintering equipment. The powder material parameters and sintering phenomenon are shown in Table 1. The performance test of the obtained sintered sample is shown in Table 2.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Property
Measurement
Unit
particle diameter
aaaaa
aaaaa
particle diameter
aaaaa
aaaaa
melting point
aaaaa
aaaaa
Login to View More
Abstract
A method for preparing a high-melting-point resin powder material for selective laser sintering, which is characterized in that it comprises the following steps: stirring part of the high-melting-point resin powder and the powder flow aid whose surface has been organically treated at a rate of 600-1800r / min Mix at a high speed to generate a high melting point resin powder predispersion, then mix and stir the high melting point resin powder predispersion, powder antioxidant, surface-treated inorganic filler and the remaining high melting point resin powder; sieve , Screening and obtaining high-melting-point resin powder materials for selective laser sintering with a particle size range of 30-100 microns, wherein the components and mass / number ratios are: high-melting-point resin powder 35%-99.8%, inorganic filler 0 %‑60%, powder flow aid 0.1%‑2%, powder antioxidant 0.1%‑1%. The high-melting point resin powder material of the present invention has excellent fluidity under high temperature conditions, and parts prepared by using the powder through selective laser sintering technology have good mechanical and mechanical properties, and are especially suitable for parts trial production and small batch production.
Description
technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to a method for preparing a high melting point resin powder material for selective laser sintering. Background technique [0002] Selective laser sintering is a method of manufacturing three-dimensional objects by selectively fusing multiple layers of powder, which allows machining without tools but only by laser sintering multiple overlapping layers of powder according to the three-dimensional image of the object to be produced, to get a 3D solid. This method is mainly accomplished using thermoplastic polymers, and patents US6136948 and WO9606881 describe in detail the method of using powdered polymers to manufacture three-dimensional objects. [0003] The selective laser sintering molding process requires that the powder material has good powder fluidity so that it can meet the requirements of powder coating during processing. At present, the types of m...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More