Active shield circuit for security chip

Abstract

The invention discloses an active shielding layer circuit of a security chip. The circuit comprises a metal shielding layer which comprises a top metal wire and a secondary top metal wire which are connected through a plurality of via holes penetrating through the metal shielding layer; an input detection circuit used for receiving the detection signal sent by the digital logic unit, amplifying the detection signal and transmitting the amplified signal to the secondary top layer metal wire, and the secondary top layer metal wire transmits the received signal to the top layer metal wire connected with the secondary top layer metal wire; an output detection circuit used for eliminating the antenna effect of the signal transmitted by the top metal wire and transmitting the processed signal tothe input interface of the digital logic unit; and a secondary top metal wire which covers the sensitive module of the security chip. According to the active shielding layer circuit of the security chip provided by the invention, the FIB detection difficulty can be increased. The attack resistance of the active shielding layer is improved.

Description

technical field [0001] The invention relates to a safety chip, in particular to an active shielding layer circuit of the safety chip. Background technique [0002] With the development of microelectronics technology, information security technology and deep submicron process technology, smart card technology continues to improve, and the application field of security chips is also expanding. The security protection technology of security chips has also become one of the topics in the field of microelectronics. [0003] Today's attacks on security chips are mainly divided into three categories: non-intrusive attack, semi-intrusive attack and intrusive attack. Intrusive attack is also called physical attack, which requires direct contact with the inside of chip components and will cause permanent damage to the chip. In this attack method, the chip package is usually removed first to expose the silicon grains, and then the chip layout is extracted through reverse engineering to...

AI Technical Summary

Problems solved by technology

[0005] However, based on this, the inventors of this application found that the accuracy of the current FIB physical attack technology has reached 5 nanometers, and the structure of this single-layer metal shielding wire has been difficult to achieve the effect of preventing physical attacks

In addition, the connection ports of the metal shielding wire and the detection sensor circuit are usually connected sequentially and exposed under the metal shielding wire. It is necessary to find the starting point and termination point of the active shielding wire and connect them in sequence. The active shielding layer The anti-attack protection fails

Images