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A device for coating protective material on the surface of chip electronic components

A technology of electronic components and surface coating, which is applied in the direction of spraying devices, spray booths, etc., can solve the problems of small size, difficult manual operation, low efficiency of coating work, etc., and achieve the effect of improving work efficiency

Active Publication Date: 2021-04-16
南理工泰兴智能制造研究院有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the shortcomings in the prior art, such as: due to the small size of the existing chip components, it is difficult to coat the surface, and because both sides of the electronic components need to be coated Therefore, the manual operation is difficult, and the electronic components need to be turned over during the coating operation, so the coating work efficiency is low

Method used

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  • A device for coating protective material on the surface of chip electronic components
  • A device for coating protective material on the surface of chip electronic components
  • A device for coating protective material on the surface of chip electronic components

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0020] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0021] refer to Figure ...

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Abstract

The invention discloses a device for coating protective materials on the surface of chip-type electronic components, which comprises a transmission roller. The centers of the two transmission rollers are fixedly connected with a rotating shaft, and both ends of the rotating shaft are fixedly connected with For the pillars, a fixing plate is fixedly connected between every two pillars on the same side, and a stepping motor is fixedly connected to a side wall of one of the pillars. The invention only needs manual feeding, and then, under the drive of the stepping motor, the electrical components can be transported to the bottom of the coating device by means of the conveying device for automatic coating and drying, and the electrical components can be driven to turn over automatically by means of magnetic force , so that the protective material can be automatically coated on both sides of the electrical components, and the material can be automatically unloaded after the coating is completed, so it is very simple and convenient to use. Since there is no need for manual turning, the work efficiency has been greatly improved.

Description

technical field [0001] The invention relates to the technical field of surface coating of electronic components, in particular to a device for coating protective materials on the surface of chip electronic components. Background technique [0002] Chip electronic components are widely used in notebook computers, TVs, DVDs, mobile communication terminals and other equipment. In order to make them have excellent solderability during the production process, the terminal electrodes of the components need to be electroplated. A variety of process reasons will cause the surface of the component to be plated with metal conductive points, so that the risk of short circuit cannot be completely avoided during the welding process of the component. In addition, the electrical performance of some components will be deteriorated due to the corrosion of the plating solution on the surface during electroplating, which will greatly reduce the yield rate. Therefore, it is necessary to Surface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/02B05B16/20
CPCB05B13/0221B05B16/20
Inventor 夏鲲
Owner 南理工泰兴智能制造研究院有限公司
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