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A kind of preparation method of ultra-fine grain structure copper and copper alloy wire, bar

An ultra-fine grain and rod technology, applied in the direction of metal extrusion dies, etc., can solve problems such as insufficient preparation and poor plasticity of materials

Active Publication Date: 2021-04-27
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, the processes for obtaining ultra-fine-grained materials mainly include equal-angle pressing, high-pressure torsion, cumulative rolling, high-energy ball milling, etc., but at present, only small pieces of nanostructured materials can be prepared, which is not enough to meet the needs of large-scale applications in practical applications. Preparation of products; the only method that can prepare large ultra-fine-grained materials is powder metallurgy, but the problem of porosity leads to poor plasticity of materials prepared by this method, which is also a problem that many researchers are trying to solve

Method used

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  • A kind of preparation method of ultra-fine grain structure copper and copper alloy wire, bar
  • A kind of preparation method of ultra-fine grain structure copper and copper alloy wire, bar
  • A kind of preparation method of ultra-fine grain structure copper and copper alloy wire, bar

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Embodiment 1

[0033] First, the present embodiment adopts the following equipment: torsion extruder, Φ12×100mm TU2 copper rod, and box-type resistance furnace for heat treatment.

[0034] The specific operation of preparing ultra-fine grain structure polycrystalline copper wire and rod in this embodiment is as follows:

[0035] The copper grade used in this embodiment is TU2, and the specific chemical composition (wt.%) is: Cu≥99.95%, and the rest are impurities.

[0036] Put the original copper rod with a diameter of 12mm and a length of 80mm into a box-type resistance furnace heated to 700°C and keep it warm for 60min to obtain equiaxed coarse-grained copper with a uniform structure and a grain size of about 150μm.

[0037] (1) The entrance of the sample is a round hole with a diameter of 12mm, and the pier thick area is an ellipse with a major axis of 14mm and a minor axis of 12mm; the entrance of the lower die is an ellipse with a major axis of 14mm and a minor axis of 12mm, followed by...

Embodiment 2

[0043] First, the present embodiment adopts the following equipment: twisting extruder, Φ10×80mm TU2 copper rod, and box-type resistance furnace for heat treatment.

[0044] The specific operation of preparing ultra-fine grain structure polycrystalline copper wire and rod in this embodiment is as follows:

[0045]The copper grade used in this embodiment is TU2, and the specific chemical composition (wt.%) is: Cu≥99.95%, and the rest are impurities.

[0046] Put the original copper rod with a diameter of 10mm and a length of 80mm into a box-type resistance furnace heated to 700°C and keep it warm for 60min to obtain equiaxed coarse-grained copper with a uniform structure and a grain size of about 150μm.

[0047] (1) The entrance of the sample is a round hole with a diameter of 10mm, and the thick area of ​​the pier is an ellipse with a major axis of 12mm and a minor axis of 10mm; the entrance of the lower die is an ellipse with a major axis of 12mm and a minor axis of 10mm, fol...

Embodiment 3

[0053] First, the present embodiment adopts the following equipment: twisting extruder, Φ12×80mm TU2 copper rod, and box-type resistance furnace for heat treatment.

[0054] The specific operation of preparing ultra-fine grain structure polycrystalline copper wire and rod in this embodiment is as follows:

[0055] The copper grade used in this embodiment is TU2, and the specific chemical composition (wt.%) is: Cu≥99.95%, and the rest are impurities.

[0056] Put the original copper rod with a diameter of 12mm and a length of 80mm into a box-type resistance furnace heated to 700°C and keep it warm for 60min to obtain equiaxed coarse-grained copper with a uniform structure and a grain size of about 150μm.

[0057] (1) The entrance of the sample is a round hole with a diameter of 12mm, and the pier thick area is an ellipse with a major axis of 14mm and a minor axis of 12mm; the entrance of the lower die is an ellipse with a major axis of 14mm and a minor axis of 12mm, followed by...

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Abstract

The invention discloses a method for continuously preparing polycrystalline metal wires and rods with dense ultrafine crystal structure, belonging to the field of metal manufacturing. While extruding, the material is rotated, and the severe plastic deformation of the material is used to realize the ultra-fine crystallization of the grain. First, the material is annealed to obtain an equiaxed grain structure with a grain size ranging from 20 to 250 μm; then it is twisted and extruded, and the extrusion speed is controlled at 0.1 to 10 mm / s, and the rotation speed of the lower mold is controlled at 10 to 10 mm. 100r / min, directly extrude the material one by one. The characterization results show that the grain size of the processed material is ultra-fine grain structure.

Description

technical field [0001] The invention relates to the field of preparation of ultra-fine-grained copper and copper alloy wires and rods, and specifically refers to a method for realizing ultra-fine crystallization of copper and copper alloy wires and rods. Background technique [0002] Grain size is the main factor affecting the mechanical properties of traditional polycrystalline materials with grain sizes above microns, and as the grain size decreases, the structure of the material has the following characteristics: There are a large number of intergranular structures in the microstructure , that is, grain boundaries and trifurcation grain boundaries. Since the grain boundary area is inversely proportional to the grain size, the total grain boundary area per unit volume of ultrafine-grained crystal materials is much higher than that of coarse-grained materials. Depending on the chemical composition of the material and the different preparation methods, the atomic density at...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08B21C25/02B21C23/08
CPCB21C23/08B21C25/02C22F1/08
Inventor 李玉胜毛庆忠朱运田张庆李建生张逸卿刘艳芳高波
Owner NANJING UNIV OF SCI & TECH