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Cooling device and electronic device

A technology of cooling device and cooling plate, which is applied in the construction parts of electrical equipment, cooling/ventilation/heating transformation, electrical components, etc., and can solve problems such as channel blockage, device overheating, and easy generation of air bubbles

Inactive Publication Date: 2019-11-08
LENOVO (BEIJING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] If the cooling plate adopts the method of phase conversion heat, the cooling liquid will easily generate bubbles when it absorbs heat and turns into a gas. The merger of the bubbles will cause reverse flow, resulting in channel blockage and the risk of overheating the device.

Method used

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  • Cooling device and electronic device
  • Cooling device and electronic device
  • Cooling device and electronic device

Examples

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Embodiment Construction

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0026] The terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting of the present disclosure. The terms "comprising", "comprising", etc. used herein indicate the presence of stated features,...

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PUM

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Abstract

The present disclosure provides a cooling device including: a cooling plate including one or more cooling passages arranged side by side and used for circulating a coolant, wherein at least one of theone or more cooling passages is provided with a variable cross-sectional portion; the variable cross-sectional portion includes a contracted portion and an expanded portion; the size of the passage cross section of the contracted portion is gradually decreased; the size of the passage cross section of the expanded portion is gradually increased; the passage cross section of the contracted sectionis decreased step by step and / or the passage cross section of the expanded section is increased step by step. The present disclosure also provides an electronic device.

Description

technical field [0001] The present disclosure relates to a cooling device and an electronic device. Background technique [0002] With the development of science and technology and network technology, users have higher and higher requirements for electronic equipment such as computers and servers. Electronic equipment undertakes a large number of data calculations, and heat will be generated during the operation of electronic equipment. When the temperature is high, it will affect Operational performance of electronic equipment. In order for electronic equipment to operate efficiently, it is necessary to cool the various heat-generating components in the electronic equipment. In the prior art, a cooling plate can be used to dissipate heat from the heating element. The cooling plate is provided with a plurality of channels for flowing through the cooling liquid, and the cooling liquid takes away heat from the heating element through heat conduction. [0003] In the process ...

Claims

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Application Information

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IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/20H05K7/20327H05K7/208
Inventor 关明慧
Owner LENOVO (BEIJING) CO LTD