Modular combined circuit board and production and manufacturing method thereof

Abstract

The invention discloses a modular combined circuit board and a production and manufacturing method thereof. The modular combined circuit board comprises a main circuit board and at least one module unit, wherein the main circuit board and the module unit are spliced and electrically connected, and the main circuit board and the module unit carry different functional circuits respectively. By changing the design and manufacturing idea, the maintenance technical threshold is reduced, the maintenance speed is increased, the replacement cost is lowered, the social resources are saved, and the environment is protected; based on the scheme, more functions can be expanded, more requirements can be achieved without increasing the maintenance difficulty and replacing cost, and the further development of the electronic technology is facilitated.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a modularized combined circuit board and a manufacturing method thereof. Background technique [0002] With the development of printed circuit board technology, the field of use of printed circuit boards continues to expand, and the functions contained are becoming more and more powerful. Moreover, with the development of electronic products towards miniaturization and digitalization, the electrical components integrated on the printed circuit board are getting smaller and smaller, the density is getting higher and higher, and the integrated functions are increasing. It is also getting higher and higher, and its maintenance is becoming more and more difficult, and the maintenance threshold is getting higher and higher. In order to pursue trouble-saving, efficiency, and reliability, more and more whole circuit boards are replaced. Due to uncertain factors such as professional...

AI Technical Summary

Problems solved by technology

Moreover, with the development of electronic products towards miniaturization and digitalization, the electrical components integrated on the printed circuit board are getting smaller and smaller, the density is getting higher and higher, and the integrated functions are increasing. It is also getting higher and higher, and its maintenance is becoming more and more difficult, and the maintenance threshold is getting higher and higher.

In order to pursue trouble-saving, efficiency, and reliability, more and more whole circuit boards are replaced. Due to uncertain factors such as professionals, professional technology, and unknown accessories, the replacement of whole circuit boards is not effective in maintenance costs. Control and maintenance costs are even higher than the manufacturing cost of printed circuit boards. It is a pity to lose it, and it is difficult to repair. After a period of time, it is difficult to escape the fate of scrapping

[0003] In the prior art, only when the length and width are restricted and the circuit layout design is limited, multiple discrete circuit boards are made and connected via pin headers or wiring harnesses, because its design concept is only to meet the requirements of the product Application requirements are not for the purpose of convenient maintenance and saving replacement costs, and cannot effectively solve the problem of maintenance and replacement

[0004] For the entire circuit board, only individual electrical components or functional circuits are damaged, but the entire circuit board must be scrapped, which will inevitably cause a great waste of resources, and generate a large amount of electronic waste, polluting the environment

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