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Board card structure for protecting thermal contact surface based on reed

A technology of thermal contact surface and reed, which is applied in the direction of instruments, electrical digital data processing, digital data processing parts, etc., can solve the problem of corrosion resistance of damaged materials, and achieve the effect of rapid detachment and avoiding damage

Inactive Publication Date: 2019-11-15
THE 724TH RES INST OF CHINA SHIPBUILDING IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, during the insertion and removal process of the heat transfer cold plate, the protective layer will be directly damaged due to the friction of the thermal contact surface of the heat dissipation cold plate, and the corrosion resistance of the material will be destroyed.

Method used

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  • Board card structure for protecting thermal contact surface based on reed
  • Board card structure for protecting thermal contact surface based on reed
  • Board card structure for protecting thermal contact surface based on reed

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The reed-based liquid-cooled VPX chassis board thermal contact surface protection and detachment structure proposed by the present invention installs the reed 1 in the groove of the heat transfer cold plate 2, and the reed 1 is glued to the heat transfer cold plate 2 On the bottom of the groove, the highest point of the reed 1 is 0.8 mm to 1.0 mm higher than the surface of the thermal interface material 5, and the highest position of the reed 1 is connected to the slot of the heat dissipation cold plate 4 during the insertion and removal process of the heat transfer cold plate 2 and the heat dissipation cold plate 4 The contact surface contacts and produces relative motion, thereby protecting the heat transfer cold plate 2 and the thermal interface material 5 on the thermal interface. After the heat transfer cold plate 2 is inserted in place, it is locked by the locking device 3. At this time, the reed 1 is The pressure is deformed, and the heat transfer cold plate 2 and...

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Abstract

The invention discloses a board card structure for protecting a thermal contact surface based on a reed. The board card structure structurally comprises a reed (1), a heat transfer cold plate (2), a locking device (3), a heat dissipation cold plate (4) and a heat conduction interface material (5). According to the structure, a groove is designed on a heat transfer contact surface of a heat transfer cold plate (2) of a case board card and is used for installing the reed (1); and in the board card plugging process, through the elastic force of the reed (1), the contact surfaces of the heat conduction interface material (5) on the heat transfer cold plate (2) and the heat dissipation cold plate (4) are rapidly separated and keep a relative distance, so that the heat conduction interface material (5) is prevented from being damaged in the plugging process.

Description

technical field [0001] The invention relates to a structural design of a reed and a chassis board. Background technique [0002] The chassis board is integrated and installed on the heat transfer cold plate. The heat transfer cold plate is the main way for the heat transfer of the circuit board of the board card. The heating device of the circuit board is closely attached to the heat transfer cold plate. Then heat is transferred through the contact surface of the upper and lower ends of the heat transfer cold plate and the heat conduction interface material with the heat dissipation cold plate, and finally the heat is taken away by the heat dissipation cold plate. On the one hand, the heat transfer cold plate of the chassis serves as the basis for board installation, and plays the role of guiding and supporting during the insertion and removal of the board; on the other hand, it plays the role of transferring the heat of the board. [0003] The bottleneck of the heat transf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/183
Inventor 唐文辉许升
Owner THE 724TH RES INST OF CHINA SHIPBUILDING IND
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