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Door opening device, transmission chamber and semiconductor processing device

A door-opening device and transmission cavity technology, which is applied in semiconductor/solid-state device manufacturing, conveyor objects, transportation and packaging, and can solve problems such as wafer pollution and affecting product yield

Active Publication Date: 2019-11-19
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These particles will enter the wafer box, thereby polluting the wafers in the wafer box and affecting the product yield

Method used

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  • Door opening device, transmission chamber and semiconductor processing device
  • Door opening device, transmission chamber and semiconductor processing device
  • Door opening device, transmission chamber and semiconductor processing device

Examples

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Embodiment Construction

[0024] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood, however, that these descriptions are exemplary only, and are not intended to limit the scope of the present disclosure. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts of the present disclosure.

[0025] An embodiment of the present disclosure provides a door opening device for opening or closing a hermetic door of a wafer cassette. See figure 1 As shown in , it shows the situation that the door opening device has not opened the sealed door of the wafer cassette. The door opening device 12 of this embodiment is a box-shaped structure, including a housing part 101 , a docking part 106 and a drivin...

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PUM

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Abstract

The invention provides a door opening device, a transmission chamber and a semiconductor processing device. The door opening device comprises a sealing door for opening or closing a wafer box, and comprises: a shell part, wherein one side, facing the wafer box, of the shell part is provided with a first opening; a driving mechanism arranged at the internal portion of the shell part; and a connection part connected with the driving mechanism and moving under the drive of the driving mechanism to open the sealing door and keep the sealing door, wherein the connection part is in sealing matchingwith the first opening through the sealing door or the connection part under the drive of the driving mechanism after the connection part opens the sealing door and is connected with the sealing door,so that the driving mechanism is sealed in the shell part.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor manufacturing, and in particular to a door opening device, a transmission chamber and semiconductor processing equipment. Background technique [0002] In the semiconductor processing technology, there are very high requirements on core process parameters such as film uniformity, film quality, metal ion pollution control and particle pollution control. In the semiconductor chip manufacturing process, the pollution of fine particles is one of the main reasons that affect the product yield and process device performance, so it is necessary to strictly control the pollution of particles to the wafer. [0003] There are many factors that affect the cleanliness of wafers, including basic materials, heater selection, moving part structure, equipment interface, wafer transfer path, gas pipeline and device cleanliness, etc. The wafer transfer process is one of the most susceptible to conta...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/67
CPCH01L21/67772H01L21/67754H01L21/67028H01L21/67098H01L21/677H01L21/67Y02P70/50
Inventor 董金卫赵晋荣
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD