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Circuit board structure and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve problems such as stress concentration and cracks, and achieve the effect of avoiding cracks

Active Publication Date: 2021-01-12
TRIPOD WUXI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing circuit board structure, a back-drilled hole is often formed on the back of the part corresponding to the through-hole, and a conductive layer is formed at the above-mentioned through-hole, but the junction between the above-mentioned back-drilled hole and the conductive layer is often reflowed ( reflow) stress concentration and cracks due to mismatch of coefficient of thermal expansion (CTE) between different materials
Furthermore, when the existing circuit board structure plugs the above-mentioned back-drilled hole, the junction between the back-drilled hole and the through hole is more prone to cracks due to stress concentration

Method used

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  • Circuit board structure and manufacturing method thereof
  • Circuit board structure and manufacturing method thereof
  • Circuit board structure and manufacturing method thereof

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Embodiment 1

[0041] Such as Figure 1 to Figure 10 As shown, it is Embodiment 1 of the present invention. This embodiment discloses a circuit board structure 100 and a manufacturing method thereof. To facilitate understanding of the circuit board structure 100 of this embodiment, the manufacturing method of the circuit board structure 100 will be described first, and then the circuit board structure 100 will be introduced.

[0042] Wherein, the manufacturing method of the circuit board structure 100 of this embodiment includes the following multiple steps, but in actual application, the order of each step and the actual operation method contained in this embodiment can be adjusted according to requirements (such as: design Those who can reasonably use or increase or decrease the above steps), are not limited to the content or sequence contained in this embodiment.

[0043] Such as figure 1 As shown, a pre-drilling step S110 is performed: drilling a multi-layer board 1 to form a pre-throu...

Embodiment 2

[0066] see Figure 11 to Figure 12B As shown, it is Embodiment 2 of the present invention. This embodiment is similar to the above-mentioned Embodiment 1, so the similarities between the two embodiments will not be repeated. The main differences between this embodiment and the above-mentioned Embodiment 1 are as follows .

[0067] Specifically, as Figure 11 As shown, when implementing the back-drilling step S160, the central axis of the back-drilled hole 14a is preferably overlapped with the central axis of the above-mentioned through hole 13a, and the diameter of the drilled hole in the back-drilled step S160 is slightly smaller than The diameter of the drilled hole in the above-mentioned pre-back-drilling step S120 is such that the protection layer 22 left by the buffer layer 21 is connected to all the walls of the pre-back-drilled hole 14 and the conductive layers 3 , 3 a.

[0068] Furthermore, if Figure 12A and Figure 12B As shown, when implementing the plugging ste...

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Abstract

The invention discloses a circuit board structure and a manufacturing method thereof. The circuit board structure includes a multi-layer board, a protective layer and a conductive layer. The multilayer board includes an upper board surface and a lower board surface located on opposite sides, and the multilayer board is formed with a through hole penetrating the upper board surface and the lower board surface. The multi-layer board is provided with a pre-back drilled hole recessed from the lower board surface corresponding to the through hole, which does not penetrate to the upper board surface, and the diameter of the pre-back drilled hole is larger than the hole diameter of the through hole. The protective layer is disposed in the pre-back drilling and connected to at least part of the hole wall of the pre-back drilling. The protective layer is flush with the hole wall of the through hole. The conductive layer is plated on the hole wall of the through hole and the protective layer portion where it is cut.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board structure and a manufacturing method thereof. Background technique [0002] In the existing circuit board structure, a back-drilled hole is often formed on the back of the part corresponding to the through-hole, and a conductive layer is formed at the above-mentioned through-hole, but the junction between the above-mentioned back-drilled hole and the conductive layer is often reflowed ( After reflow), stress concentration and cracks occur due to the mismatch of coefficient of thermal expansion (CTE) between different materials. Furthermore, when the back-drilled hole is plugged in the existing circuit board structure, the junction of the back-drilled hole and the through hole is more prone to cracks due to stress concentration. [0003] Therefore, the inventor of the present invention believes that the above-mentioned defects can be improved, so he devoted himself to research a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0047H05K3/429H05K2203/0214
Inventor 朱健祥桂华荣罗仕洋孙奇石汉青
Owner TRIPOD WUXI ELECTRONICS