Full-automatic chip mounting device for SMT (Surface Mounted Technology) mobile phone double-parallel production line

Abstract

The invention discloses a full-automatic chip mounting device for an SMT (Surface Mounted Technology) mobile phone double-parallel production line. The device comprises raw material conveying equipment, a disc and feeding and conveying equipment, wherein the raw material conveying equipment and the feeding and conveying equipment are arranged in parallel, a base is arranged in a gap between the raw material conveying equipment and the feeding and conveying equipment, the upper surface of the base is slidably connected with a rotating base through a sliding block, the upper surface of the baseis provided with an annular groove matched with the sliding block in use, a driving motor is fixed in the base, and an output shaft of the driving motor is fixedly welded to the rotating base. In theinvention, when one sucker mounting head performs chip mounting operation, the other sucker mounting head can be located on the feeding and conveying equipment at the same time to suck materials, so that chip mounting and material sucking are performed at the same time, the material sucking time is saved, the chip mounting efficiency is improved to the greatest extent, and the economic benefit isincreased.

Description

technical field [0001] The invention relates to the technical field of patch production equipment, in particular to a full-automatic patch device for double-parallel production lines of SMT mobile phones. Background technique [0002] SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation of Surface Mounted Technology), which is currently the most popular technology and process in the electronics assembly industry. Electronic circuit surface assembly technology (Surface Mount Technology, SMT), known as surface mount or surface mount technology. It is a kind of non-lead or short-lead surface mount components (SMC / SMD for short, Chinese called chip components) mounted on the surface of the printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, through Circuit assembly and connection technology that is soldered and assembled by methods such as reflow soldering or dip soldering. [0003] At present, for SMT mobile phone product...

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Problems solved by technology

[0003] At present, for SMT mobile phone production line patch production equipment, generally, a single suction cup placement head is set up, which absorbs the material and then transfers it to the position of the raw material for placement, and then absorbs the material and then transfers it to the position of the raw material for placement. , this way of working, the work efficiency is relatively low, so it cannot meet the needs of users

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